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[News] SK hynix Advances DRAM and NAND Roadmap, Targets 3x Wafer Output by 2034, 375-Layer NAND at Year-End - TrendForce

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www.trendforce.com 2026-06-11 TrendForce

[News] SK hynix Advances DRAM and NAND Roadmap, Targets 3x Wafer Output by 2034, 375-Layer NAND at Year-End 2026-06-11 Semiconductors editor News Please note that this article cites information from Nikkei, The Elec, Newsis, Hankyung, and Global Economic. While SK hynix had only last week outlined plans to double capacity over the next five years, the memory giant is now signaling an eve

Semiconductor DRAM NAND Flash SK Hynix Wafer Capacity 375-layer NAND Semiconductor Manufacturing Memory

[News] Samsung May Announce New Gwangju Advanced Packaging Base by End-June as Capacity Expansion Continues - TrendForce

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www.trendforce.com 2026-06-10 TrendForce

[News] Samsung May Announce New Gwangju Advanced Packaging Base by End-June Amid Capacity Expansion 2026-06-10 Semiconductors editor News Please note that this article cites information from Hankyung, New Daily, Reuters, and The Dong-A Ilbo. Samsung Electronics is reportedly looking to expand its advanced packaging capacity. According to Hankyung, sources say the company is pursuing plan

Samsung Electronics Advanced Packaging Capacity Expansion Gwangju Facility Semiconductor Manufacturing HBM Technology Packaging and Testing Vietnam Investment

[News] Samsung, NVIDIA Deepen Ties as Talks Reportedly Expand to HBM5 Next Year and Next-Gen Groq Chips - TrendForce

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www.trendforce.com 2026-06-09 TrendForce

[News] Samsung, NVIDIA Deepen Ties as Talks Reportedly Expand to HBM5 Next Year and Next-Gen Groq Chips 2026-06-09 Semiconductors editor News Please note that this article cites information from The Chosun Daily, Seoul Economic Daily, ZDNet, Yonhap News, Newspim, and Dealsite. Following Jensen Huang’s high-profile meetings with SK hynix during his South Korea visit, Samsung Electronics V

Semiconductor Industry NVIDIA Samsung Electronics HBM Memory Chip Manufacturing Foundry Services Groq Chips Autonomous Driving Chips

[News] Intel Foundry Gains Momentum as Google Reportedly Orders 3M TPUs, NVIDIA Evaluates 18A for Multi-Die GPUs - TrendForce

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www.trendforce.com 2026-06-09 TrendForce

[News] Intel Foundry Gains Momentum as Google Reportedly Orders 3M TPUs, NVIDIA Evaluates 18A for Multi-Die GPUs 2026-06-09 Semiconductors editor News Please note that this article cites information from The Information, Reuters, The Bull.com, Guru Focus, Wccftech, Futu News, Commercial Times, and Tom’s Hardware. Amid mounting capacity constraints and a widening shift among leading AI pl

Intel Foundry TPU Chips Google AI NVIDIA GPU 18A Process Multi-die Design Advanced Packaging AI Chip Supply Chain

[News] SK hynix to Supply Memory for NVIDIA Vera CPU as Partnership Deepens; Samsung Meeting in Spotlight - TrendForce

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www.trendforce.com 2026-06-08 TrendForce

[News] SK hynix to Supply Memory for NVIDIA Vera CPU as Partnership Deepens; Samsung Meeting in Spotlight 2026-06-08 Semiconductors editor News Please note that this article cites information from Global Economic News, ZDNet, Bloomberg, SK hynix, and NVIDIA. Following confirmation that the “big three” memory makers—Samsung Electronics, SK hynix, and Micron—have secured HBM4 supply approv

NVIDIA SK hynix Memory Supply AI Infrastructure Data Center CPU HBM4 LPDDR5X Semiconductor Collaboration

[News] Onsemi Reportedly Plans Up to 300 Job Cuts in Czech Plant as Low-cost Chinese SiC Competition Intensifies - TrendForce

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www.trendforce.com 2026-06-08 TrendForce

[News] Onsemi Reportedly Plans Up to 300 Job Cuts in Czech Plant as Low-cost Chinese SiC Competition Intensifies 2026-06-08 Semiconductors editor News Please note that this article cites information from e15, iROZHLAS, Central News Agency and Czech Semiconductor Centre. Amid intensifying competition from Chinese players, Onsemi is reportedly under mounting pressure, with up to 300 job cu

Silicon Carbide Semiconductor Manufacturing Czech Plant Job Cuts Supply Chain Competition SiC Wafer Chinese Semiconductors Onsemi

[News] Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows - TrendForce

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www.trendforce.com 2026-06-05 TrendForce

[News] Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows 2026-06-05 Semiconductors editor News Please note that this article cites information from Sisa Journal, Economic Daily News, Commercial Times, Forbes and The Elec. As AI chips continue to scale in size and complexity, demand is rising for next-generation packaging and substrate so

Glass Substrate Advanced Packaging CoWoS AI Chip TSMC NVIDIA Hyperscaler Semiconductor Material

[News] Laser Annealing Adoption May Broaden with Wolfspeed, Samsung SiC Push and 400-Layer NAND Expansion - TrendForce

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www.trendforce.com 2026-06-05 TrendForce

[News] Laser Annealing Adoption May Broaden with Wolfspeed, Samsung SiC Push and 400-Layer NAND Expansion 2026-06-05 Semiconductors editor News Please note that this article cites information from ETNews and Korea Credit News. Laser annealing adoption appears to be broadening. According to ETNews, the thermal treatment process is expanding beyond its traditional use in silicon (Si) wafer

Laser Annealing Silicon Carbide Power Semiconductors NAND Flash 400-Layer NAND SiC Wafer Semiconductor Equipment Wafer Fabrication

[News] TSMC Rejects High-NA EUV Investment Concerns, Confirms Purchase for R&D Use - TrendForce

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www.trendforce.com 2026-06-04 TrendForce

[News] TSMC Rejects High-NA EUV Investment Concerns, Confirms Purchase for R&D Use 2026-06-04 Semiconductors editor News Please note that this article cites information from TechNews, Liberty Times, Tom’s Hardware, and Reuters. As Intel advances its High-NA EUV roadmap for its A14 node, market attention has turned to TSMC’s comparatively cautious approach to the cutting-edge lithography

TSMC High-NA EUV EUV Lithography Semiconductor Manufacturing Capital Expenditure R&D Investment Advanced Process Nodes ASML

[News] Samsung Foundry Reportedly in Talks With Chinese Carmakers Like BYD for 2nm, 4nm Autonomous Driving SoCs - TrendForce

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www.trendforce.com 2026-06-03 TrendForce

[News] Samsung Foundry Reportedly in Talks With Chinese Carmakers Like BYD for 2nm, 4nm Autonomous Driving SoCs 2026-06-03 Semiconductors editor News Please note that this article cites information from Seoul Economic Daily and EE Times China. Samsung Foundry appears poised to win new business from China’s leading automakers. According to Seoul Economic Daily, industry sources say Samsun

Samsung Foundry Autonomous Driving SoC BYD Semiconductor Manufacturing Chinese Automakers 2nm Process 4nm Process AI Chip

[News] Infineon Announces Second 2026 Price Hike Effective July 1 Amid Rising Supply Chain Costs, Strong Demand - TrendForce

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www.trendforce.com 2026-05-27 TrendForce

[News] Infineon Announces Second 2026 Price Hike Effective July 1 Amid Rising Supply Chain Costs, Strong Demand 2026-05-27 Semiconductors editor News Please note that this article cites information from TechNews and Commercial Times. Infineon has announced another price increase. According to TechNews, the company informed customers and partners on the 26th that it will adjust prices for

Infineon Semiconductor Price Hike Supply Chain Costs Power Semiconductors AI Expansion Global Supply Chain PMIC MOSFET

[News] TSMC Reportedly Eyes Up to 15% 3nm Price Hike in 2H26, Further 5%–10% Seen in 2027 Amid AI, ASIC Demand - TrendForce

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www.trendforce.com 2026-05-27 TrendForce

[News] TSMC Reportedly Eyes Up to 15% 3nm Price Hike in 2H26, Further 5%–10% Seen in 2027 Amid AI, ASIC Demand 2026-05-27 Semiconductors editor News Please note that this article cites information from Commercial Times, Liberty Times, and UDN News. AI continues to drive tightness in advanced process capacity at TSMC. According to Commercial Times, citing sources, TSMC is expected to rais

TSMC 3nm process AI chips Semiconductor pricing Advanced process Chip demand Cloud computing NVIDIA

[News] SK hynix Introduces iHBM Solution, Targets HBM5 Adoption with 30% Thermal Resistance Reduction - TrendForce

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www.trendforce.com 2026-05-26 TrendForce

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[News] AMD Zen 7 Reportedly Built on TSMC A14 Node as Powertech’s FOPLP Packaging Said to Be Under Evaluation - TrendForce

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www.trendforce.com 2026-05-25 TrendForce

[News] AMD Zen 7 Reportedly Built on TSMC A14 Node as Powertech’s FOPLP Packaging Said to Be Under Evaluation 2026-05-25 Semiconductors editor News Please note that this article cites information from Commercial Times and TweakTown. With the CEOs of AMD and NVIDIA arriving in Taiwan back-to-back ahead of COMPUTEX in early June, their visits to key supply chain partners for next-generatio

AMD Zen 7 TSMC A14 node Powertech FOPLP packaging 3D V-Cache CPU architecture semiconductor supply chain

[News] Intel Says EMIB Customers Back Substrate Prepayments; 4 Taiwan, 2 Japan Suppliers Seek Commitments - TrendForce

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www.trendforce.com 2026-05-20 TrendForce

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[News] TSMC Sees AI Wafer Demand Rising 11x From 2022–2026, Targets CoWoS With 24 HBM Stacks in 2029 - TrendForce

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www.trendforce.com 2026-05-14 TrendForce

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TSMC AI chips Wafer manufacturing AI compute demand Semiconductor supply chain Advanced process nodes CoWoS technology HBM stacking

[News] China’s Wide Bandgap Chip Players Diverge, as GaN RF Surges; SiC Profitability Under Pressure - TrendForce

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