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TrendForce reports that TSMC is expanding outsourcing of key CoWoS front-end processes to OSATs amid surging demand from NVIDIA and ASIC markets. CoWoS technology is crucial for advanced packaging, particularly for high-performance computing chips used in AI and data center applications. As NVIDIA m

TSMC CoWoS Front-end process Outsourcing NVIDIA ASIC Semiconductor manufacturing OSAT

[News] MediaTek Advances 400G SerDes on 2nm, Targeting Google TPU v10 and Meta AI ASIC Orders - TrendForce

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www.trendforce.com 2026-08-03

MediaTek has achieved a significant technological breakthrough in semiconductor development, successfully advancing 400G SerDes technology on 2nm process, targeting major orders from Google's TPU v10 and Meta's AI ASIC. This advancement demonstrates MediaTek's growing capabilities in advanced proces

MediaTek 2nm process SerDes Google TPU Meta AI Semiconductor manufacturing Chip design AI chips

Intel EMIB yields hit target, MediaTek eyes 2028 ASIC ramp

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digitimes.com 2026-08-03

MediaTek eyes high-single-digit revenue growth, 20% ASIC share by 2027

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digitimes.com 2026-08-01

Qualcomm's Near-Term Visibility 'Cloudy' As ASIC Ramp, Apple Roll-Off Weigh on Margins - Benzinga

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www.benzinga.com 2026-07-31

The Most Basic Economics Lesson Is Why I Won’t Stop Buying Nvidia This Earnings Season - 24/7 Wall St.

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247wallst.com 2026-07-25

This article analyzes NVIDIA's central role in the AI revolution and the underlying drivers of its sustained growth. Despite market concerns over whether hyperscalers will reduce AI spending, actual order books and capital expenditure data show accelerating demand. Major players like Microsoft are i

NVIDIA AI Data Center Semiconductor AI Chip Capital Expenditure Hyperscalers Revenue Growth

Intel to co-develop and manufacture Fortinet's next-gen firewall ASIC

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tomshardware.com 2026-07-21

Intel and cybersecurity company Fortinet have announced a strategic collaboration to co-develop the next-generation Fortinet Security Processor 6 (SP6), a custom ASIC for FortiGate firewalls. This marks Fortinet as the first external silicon customer for Intel's 4 process node, which uses EUV lithog

Semiconductor chips Cybersecurity Chip design Manufacturing process Firewall technology Custom ASIC Intel collaboration Fortinet

Powertech and Broadcom expand AI ASIC push with US$400M Singapore FOPLP venture

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digitimes.com 2026-07-17

QBit Semiconductor June revenue hits record as SoC and ASIC demand rises

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digitimes.com 2026-07-15

CSP ASIC demand drives structural growth in high-speed interconnects

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digitimes.com 2026-07-10

Morgan Stanley Report: CoWoS Demand to Double by 2027, Driven by AMD and ASICs in AI Chip Growth - KuCoin

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www.kucoin.com 2026-07-09

Morgan Stanley's latest AI supply chain report forecasts that global CoWoS demand will surge to 2.694 million wafers by 2027, up 93% from 1.394 million in 2026. While NVIDIA remains the largest user at 45%, AMD is emerging as a key growth driver with a 308% increase. Notably, AMD’s first CPU to use

CoWoS AI chips Semiconductor packaging AMD NVIDIA GPU CPU Advanced packaging

Nvidia: Jensen's Anti-ASICs Alliance (Rating Downgrade) (NASDAQ:NVDA) - Seeking Alpha

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seekingalpha.com 2026-07-07

2nm foundry orders surge again! Samsung secures massive ASIC order from Meta, with backlog racing toward KRW 50 trillion - 富途牛牛

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news.futunn.com 2026-07-03

2nm foundry orders surge again! Samsung secures massive ASIC order from Meta, with backlog racing toward KRW 50 trillion - Moomoo

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www.moomoo.com 2026-07-03

Ugreen Nexode Pro 100W: New GaN Charger with 4 Ports and a Smart Display - Basic Tutorials

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news.google.com 2026-07-03

LG Electronics moves into ASIC design services as TSMC ties draw attention

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digitimes.com 2026-07-02

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