Semiconductor News & Analysis Feed
9655 articles
2026-07-07
tomshardware.com
2026-07-07
Anton Shilov
Kioxia, Sandisk begin to sample BiCS10 3D NAND: 332 active layers and over 29 Gb/mm2 areal capacity.
2026-07-07
tomshardware.com
2026-07-07
Bruno Ferreira
Unix copyright code infringement back from the dead — IBM is still under fire from Xinuos about 2003-era bytes, with a hearing as recent as June 22.
2026-07-07
tomshardware.com
2026-07-07
Bruno Ferreira
Well-known engineer Matthias Balwierz (aka Bitluni) designed and created an 8,192-core RISC-V GPU at home.
2026-07-07
tomshardware.com
2026-07-07
Etiido Uko
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
2026-07-07
tomshardware.com
2026-07-07
Luke James
Brokerage consensus puts Samsung's full-year 2026 operating profit near 300 trillion won.
2026-07-07
eetimes.com
2026-07-07
eSIM turns SIMs into device trust anchors for IoT, cars and AI, letting fleets switch networks and stay secure remotely.
2026-07-07
digitimes.com
2026-07-07
Lenovo confirmed that some notebooks sold outside China now use solid-state drives from Yangtze Memory Technologies Co. (YMTC), marking the first known appearance of the Chinese memory maker's SSDs in an overseas Lenovo model. The move comes as global PC makers face tighter NAND flash supply and higher prices.
2026-07-07
digitimes.com
2026-07-07
The planned acquisition of Element Solutions by Solstice Advanced Materials would create a larger supplier serving electronics, data center cooling, and other industrial markets closely watched by customers and investors worldwide. The deal may reshape competition in advanced materials, where demand is rising alongside artificial intelligence infrastructure, semiconductor manufacturing, and energy
2026-07-07
digitimes.com
2026-07-07
Samsung Electronics and SK Hynix are reportedly accelerating efforts to reduce China's role in their semiconductor supply chains in preparation for the possibility of tighter US export controls. The two companies are said to be restructuring their sourcing of materials, components, and manufacturing equipment that rely heavily on China, while gradually replacing some Chinese-made semiconductor too
2026-07-07
digitimes.com
2026-07-07
Global markets are likely to feel the effects of a renewed rise in memory prices, as tighter supply and early inventory buying lift DRAM and NAND prices again in mid-June 2026. The trend could ripple through smartphones, PCs, and servers, while Apple's possible sourcing shifts may influence pricing across the wider semiconductor industry.
2026-07-07
digitimes.com
2026-07-07
Unimicron Technology has priced a large overseas depositary receipt sale that could affect global investors monitoring Taiwan's electronics supply chain and semiconductor-related financing trends. The deal, which will fund foreign-currency purchases, is expected to reduce interest costs and strengthen the company's balance sheet, with potential benefits for shareholders worldwide.
2026-07-07
digitimes.com
2026-07-07
Micron Technology and Ford Motor Company have entered into a long-term supply agreement to strengthen access to automotive memory and storage products. The deal underscores how chip supply stability is becoming more important for vehicle makers and consumers worldwide as cars rely more heavily on advanced electronics and data systems.
2026-07-07
digitimes.com
2026-07-07
Memory contract prices are poised for another sharp rise in the third quarter of 2026, even after several quarters of hikes have already begun to weaken consumer demand. Industry sources said hopes for a clear slowdown have faded, as upstream suppliers have signalled increases of around 30%, with enterprise SSD and server RDIMM prices likely to rise by more than 30%.
2026-07-07
digitimes.com
2026-07-07
Amid ever-shifting geopolitical concerns and a US$50 billion injection from the CHIPS and Science Act to revitalize domestic semiconductor production, a new round of competition has arisen across the US to attract investment. For Taiwan's electronics sector, the question is no longer whether to invest in the US, but which state to choose.
2026-07-07
digitimes.com
2026-07-07
China memory makers are diverging in their outlook as AI demand keeps the global memory market tight. After GigaDevice recently issued an unusual risk warning, Beijing-based special memory and embedded processor maker Ingenic said global DRAM foundry capacity remains broadly constrained and is unlikely to improve before the second half of 2027.
2026-07-07
digitimes.com
2026-07-07
While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.
2026-07-07
digitimes.com
2026-07-07
Tokyo Artisan Intelligence said it has finished validating its Sting Ray test chip, a step that could broaden access to lower-power edge AI hardware for industries worldwide. The milestone highlights how startups and foundries are pushing specialized chips that may ease energy pressure from AI, even as they support real-time applications in factories, transport, and infrastructure.
2026-07-07
digitimes.com
2026-07-07
Memory module maker Transcend Information reported consolidated revenue of NT$5.07 billion (approx. US$138.66 million) for June 2026. Revenue declined 19.5% from the previous month due to customer inventory adjustments at the end of the quarter, but it still surged 381.6% compared with June 2025.
2026-07-07
digitimes.com
2026-07-07
Broadcom has extended its custom chip supply agreement with Apple through 2031, strengthening a key supplier tie that could shape wireless connectivity, AI infrastructure, and device design for years. The move offers investors greater visibility, while global consumers may ultimately see faster, more integrated Apple hardware and network performance.
2026-07-07
digitimes.com
2026-07-07
Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity remains tight, pushing demand into foundries, back-end assembly, testing, and overseas fabs. The strain is creating spillover opportunities across the broader semiconductor supply chain, while also exposing how dependent the market has become on limited high-end capac