[News] MediaTek Reportedly Adopts Dual Packaging Strategy With Intel EMIB, TSMC CoWoS for AI ASIC Push - TrendForce

MediaTek is reportedly adopting a dual packaging strategy with Intel's EMIB and TSMC's CoWoS technologies to advance its AI ASIC development. This strategic move demonstrates MediaTek's commitment to ... Read original →

MediaTek’s dual-path adoption of Intel’s EMIB and TSMC’s CoWoS is less about performance optimization and more a strategic hedge against supply concentration risk. This move pressures TSMC to accelerate CoWoS capacity while compelling Intel to open EMIB interfaces to broaden its ecosystem. Technically, heterogeneous integration of HBM and logic dies may see lower costs, but yield management and test complexity will surge. Geopolitically, diversifying advanced packaging sources mitigates U.S.-China decoupling risks, yet increases IP licensing and export compliance overhead. In response to NVIDIA’s Grace-Hopper vertical stack and Qualcomm’s Arm-based Nuvia AI chips, MediaTek leverages supply-chain agility to win ASIC design wins. Over the next 18 months, if CoWoS remains supply-constrained, EMIB could emerge as a viable alternative for second-tier AI chipmakers—signaling a shift from pure performance-driven packaging to resilience-first integration strategies.