Semiconductor News & Analysis Feed
27 articles
2026-07-03
www.digitimes.com
2026-07-03
digitimes
2026-07-03
digitimes.com
2026-07-03
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components and Technology Conference described a shift in which Intel, Marvell, TSMC, and others detailed new packaging approaches as packages themselves begin hitting limits.
2026-07-03
newsletter.semianalysis.com
2026-07-03
SemiAnalysis
2026-06-20
www.igorslab.de
2026-06-20
igor´sLAB
INTEL • LATEST NEWS
Intel makes Advanced Packaging its own foundry focus: former SK hynix chief to scale EMIB-T and HBI
20. June 2026 06:00Samir Bashir
📖 Reading time: approx. 7 minutes · 1,308 words · 8,649 characters
A modern AI chip is no longer simply a single piece of silicon. It is a densely packed system of compute chiplets, HBM, I/O dies, networking components, and power delivery. Anyone
2026-06-20
www.igorslab.de
2026-06-20
igor´sLAB
INTEL • LATEST NEWS
Intel makes Advanced Packaging its own foundry focus: former SK hynix chief to scale EMIB-T and HBI
20. June 2026 06:00Samir Bashir
📖 Reading time: approx. 7 minutes · 1,308 words · 8,649 characters
A modern AI chip is no longer simply a single piece of silicon. It is a densely packed system of compute chiplets, HBM, I/O dies, networking components, and power delivery. Anyone
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
english.cw.com.tw
2026-06-15
天下雜誌
english.cw.com.tw
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2026-06-10
www.tomshardware.com
2026-06-10
Tom's Hardware
Tech Industry
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
News-analysis
By Luke James published 3 days ago
TSMC's CoWoS lines are sold out through 2027, and Intel's EMIB is the only credible second source.
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2026-06-02
news.futunn.com
2026-06-02
富途牛牛
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2026-06-02
wccftech.com
2026-06-02
Wccftech
wccftech.com
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2026-05-29
digitimes.com
2026-05-29
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.
2026-05-29
www.technetbooks.com
2026-05-29
Technetbook
Home News
Intel Fellow Ravi Mahajan on how EMIB and Advanced Packaging Drive Modern AI Computing
Intel Foundry Advanced Packaging Evolution and EMIB Development for Artificial Intelligence Workloads and Future Semiconductor Architecture Solutions
The semiconductor industry is at a turning point where shrinking transistors is no longer sufficient to support the massive computational power needed
2026-05-20
www.trendforce.com
2026-05-20
TrendForce
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2026-05-16
www.ad-hoc-news.de
2026-05-16
AD HOC NEWS
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2026-05-12
www.trendforce.com
2026-05-12
TrendForce
HomeNews
2026-05-11
www.moomoo.com
2026-05-11
Moomoo
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2026-05-11
www.tomshardware.com
2026-05-11
Tom's Hardware
Copy linkFacebookXWhatsappRedditPinterestFlipboardEmailShare this article4Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterShare prices of both Intel and SK hynix have surged following aZDNet Koreareport claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology, with
2026-05-11
www.trendforce.com
2026-05-11
TrendForce
HomeNews
2026-05-11
wccftech.com
2026-05-11
Wccftech
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2026-05-11
www.techpowerup.com
2026-05-11
TechPowerUp
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