SemiPulse — Semiconductor Intelligence

AP Memory IPD enters Intel's EMIB supply chain, shipments set for 2Q26

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digitimes.com 2026-05-22

Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products, also known as discrete silicon capacitors (IPD), will begin small-volume shipments in the second quarter of 2026, making it the first supplier qualified for Intel's embedded multi-die interconnect bridge (EMIB) advanced

[News] Intel Says EMIB Customers Back Substrate Prepayments; 4 Taiwan, 2 Japan Suppliers Seek Commitments - TrendForce

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www.trendforce.com 2026-05-20 TrendForce

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SK Hynix’s Packaging Pivot: Why EMIB Could Reshape the HBM Supply Chain - AD HOC NEWS

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www.ad-hoc-news.de 2026-05-16 AD HOC NEWS

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MediaTek courts Intel as Google pushes for alternatives to CoWoS

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digitimes.com 2026-05-14

MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely watched strategic moves.

[News] MediaTek Reportedly Adopts Dual Packaging Strategy With Intel EMIB, TSMC CoWoS for AI ASIC Push - TrendForce

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www.trendforce.com 2026-05-12 TrendForce

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MediaTek TSMC Intel AI chip ASIC Packaging technology EMIB CoWoS

Taiwan Semiconductor’s Dominance in Packaging Faces Subtle Shifts: SK Hynix Collaborates with Intel to Test EMIB Technology, Potentially Triggering Significant Changes in the AI Chip Supply Chain - Moomoo

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www.moomoo.com 2026-05-11 Moomoo

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Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration - Tom's Hardware

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www.tomshardware.com 2026-05-11 Tom's Hardware

Copy linkFacebookXWhatsappRedditPinterestFlipboardEmailShare this article4Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterShare prices of both Intel and SK hynix have surged following aZDNet Koreareport claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology, with

Semiconductor packaging High-bandwidth memory EMIB technology Chip manufacturing SK hynix Intel AI data centers Memory market

[News] SK hynix Reportedly Tests Intel EMIB 2.5D Packaging With HBM Amid TSMC CoWoS Tightness - TrendForce

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www.trendforce.com 2026-05-11 TrendForce

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Semiconductor Packaging EMIB Technology HBM Memory TSMC SK Hynix Intel 2.5D Packaging Chip Manufacturing

SK hynix Turns to Intel’s EMIB Packaging as TSMC CoWoS Bottlenecks Squeeze the AI Supply Chain - Wccftech

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wccftech.com 2026-05-11 Wccftech

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SK hynix Eyes Intel EMIB 2.5D Packaging for HBM Memory - TechPowerUp

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www.techpowerup.com 2026-05-11 TechPowerUp

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New option for HBM packaging? SK Hynix may collaborate with Intel, with EMIB technology gaining favor. - Moomoo

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www.moomoo.com 2026-05-11 Moomoo

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New option for HBM packaging? SK Hynix may collaborate with Intel, with EMIB technology gaining favor. - 富途牛牛

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news.futunn.com 2026-05-11 富途牛牛

访问频繁，请稍后重试您所要访问的页面不在这儿，它可能正忙着刷牛牛圈，稍后就能恢复正常返回主页

HBM packaging Memory chips Semiconductor packaging SK Hynix Intel EMIB technology Advanced packaging Memory storage

Intel shifts data center chip packaging to Vietnam and expands EMIB advanced packaging integration - digitimes

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www.digitimes.com 2026-05-07 digitimes

Intel is relocating a data center chip production line from Costa Rica to its Vietnam facility. The move, flagged in a Saigon Hi-Tech Park management board report to the Ho Chi Minh City People's Committee and cited byThe Investorand VN Economy,...The article requires paid subscription.Subscribe Now

Intel data center chips Vietnam manufacturing chip packaging EMIB semiconductor manufacturing supply chain relocation semiconductor industry

AI Chip Packaging Constraints Create an Opening for Intel’s EMIB Technology - 24/7 Wall St.

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247wallst.com 2026-05-06 24/7 Wall St.

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Intel Places Huge Order For Equipment Related To Advanced Packaging Production, Signaling Huge Interest in EMIB - Wccftech

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wccftech.com 2026-05-05 Wccftech

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The competition in advanced packaging technology is intensifying! Intel's EMIB-T yield has reached 90%, potentially to be used in Google’s next-generation TPU. - Moomoo

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www.moomoo.com 2026-05-04 Moomoo

[News] Intel’s EMIB Reportedly Gains Traction at Google, Meta; Yields Said to Reach ~90% Milestone - TrendForce

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www.trendforce.com 2026-05-04 TrendForce