Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration - Tom's Hardware

Following reports of a partnership between Intel and SK hynix to develop 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology for high-bandwidth memory (HBM) integrati... Read original →

If Intel and SK hynix truly advance EMIB-based HBM integration, it will trigger a structural reset in advanced packaging. EMIB’s lower thermal overhead and cost directly undercut TSMC’s CoWoS premium in AI accelerators. For SK hynix, this isn’t just capacity diversification—it’s a strategic leap toward owning HBM integration IP. Backed by U.S. CHIPS Act subsidies, its Indiana fab becomes a geopolitically secure node. While NVIDIA and AMD remain locked into CoWoS short-term, hyperscalers like Google and Amazon are already hedging with Intel to mitigate supply risk. Within 18 months, successful EMIB-T adoption for HBM4 could force TSMC to either expand CoWoS access or cut prices, while pressuring Samsung to accelerate X-Cube. This race isn’t just about packaging—it’s a battle over who defines the post-Moore’s Law compute stack.