www.igorslab.de
2026-06-20
Intel has restructured its foundry division, elevating advanced packaging to a core business unit and appointing former SK Hynix CEO Seok-Hee Lee as Executive Vice President of Intel Foundry. Lee will lead advanced packaging, system integration, and back-end manufacturing, separating these functions
www.igorslab.de
2026-06-20
Intel has restructured its foundry division to focus on advanced packaging as a core business unit, appointing former SK hynix CEO Seok-Hee Lee as Executive Vice President of Intel Foundry. Lee will lead advanced packaging, system integration, and backend manufacturing, separating these functions fr