Intel takes aim at TSMC's CoWoS lead with EMIB-T - digitimes

As transistor density scaling slows, chipmakers are increasingly relying on advanced packaging to sustain performance improvements in accelerators. According to a SemiAnalysis roundup of this year's I... Read original →

As Moore’s Law stalls, advanced packaging has shifted from a supporting role to the frontline of performance competition. Intel’s EMIB-T directly targets TSMC’s CoWoS dominance in Taiwan, China, aiming to reset interconnect standards for AI and HPC chips. This move pressures EDA vendors and substrate suppliers to adapt rapidly to heterogeneous integration norms while raising design complexity at 3nm and below. Geopolitically, U.S. incentives favor Intel’s domestic packaging push, yet its supply chain lags TSMC’s mature CoWoS yield infrastructure. In response, TSMC will likely accelerate SoIC and InFO-RDL bundling with key clients like NVIDIA and Marvell to fortify its ecosystem. Over the next 18 months, packaging will become foundries’ second profit engine—marginalizing smaller players lacking co-design capabilities.