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[News] Intel Foundry Gains Momentum as Google Reportedly Orders 3M TPUs, NVIDIA Evaluates 18A for Multi-Die GPUs - TrendForce

www.trendforce.com 2026-06-09 TrendForce
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Intel FoundryTPU ChipsGoogle AINVIDIA GPU18A ProcessMulti-die DesignAdvanced PackagingAI Chip Supply ChainSemiconductor ManufacturingChip Foundry Competition
News Summary
Amid rising demand for AI chips and a growing trend toward supply chain diversification, Intel's foundry business is gaining momentum. According to reports from Reuters and The Bull.com citing The Inf... Read original →
Industry Analysis
Intel Foundry’s recent wins stem from the convergence of AI chiplet architectures and geopolitical supply chain de-risking. Google’s adoption of Intel’s EMIB—now nearing 90% yield—is less about packaging tech alone and more a strategic hedge against overreliance on TSMC in Taiwan, China. This forces TSMC to accelerate CoWoS capacity diversification beyond Asia. NVIDIA’s evaluation of Intel 18A for multi-die GPUs isn’t merely technical—it’s a compliance-driven redundancy play under U.S. CHIPS Act constraints. If Intel delivers 18A with PPA parity to TSMC’s A16 by late 2025, its foundry could shift from fallback to primary choice for Meta, Tesla, and others seeking onshore resilience. Yet massive capex and yield volatility remain latent risks; any slippage beyond 2026 could trigger a repeat of Intel’s past node delays, eroding hard-won credibility.
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