Semiconductor News & Analysis Feed

Intel reportedly solves one of the key issues that plagued its 18A process technology, but others may still be there.

Tesla hires an Intel veteran, who most recently was responsible for installing advanced tools at Intel's Arizona fab that is now ramping production of chips using 18A fabrication process.

A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis showed the HiSilicon Kirin 9030 processor was made on SMIC's third-generation 7nm-class N+3 process with a local metal pitch narrower than that of Intel's 18A chip used in Panther Lake.

Intel's New 18A-P Process Enters Production To Fight TSMC For AI by Zak Killian — Wednesday, June 17, 2026, 02:50 PM EDT Comments Intel is taking the fight directly to TSMC with its latest foundry milestone, signaling that its aggressive turnaround strategy is bearing real fruit. At the 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits, the company announced that its next-generation Intel 1

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Intel Foundry Describes New 18A-P Process The 2nm-class process enables high-performance chips. It features a dual contact, low resistance transistor option SEMIECOSYSTEM JUN 17, 2026 10 1 Share By Mark LaPedus At this week’s VLSI Symposium, Intel Foundry provided an update on its process roadmap, including the status of its new 18A-P technology. Targeted for the foundry market, Intel’s 18A-P p

Intel's enhanced 18A-P has entered risk production, laying the groundwork to ramp the node into full production in the coming months.

SemiAnalysis has published the first teardown from its new in-house lab, focusing on the minimum local metal pitch on SMIC’s third-gen 7nm at 32.5nm.

News / TradingView / Key facts: Intel tests 18A multi‑die; backup AI foundry; Cadence 14A Key facts: Intel tests 18A multi‑die; backup AI foundry; Cadence 14A Less than 1 min read INTC +11.19% Intel is testing its 18A process and advanced packaging to see if four GPU dies can be fused into one chip for Nvidia’s 2028 Feynman GPUs; trials assess multi‑die fabrication feasibility. 1 2 3 Multiple

[News] Intel Foundry Gains Momentum as Google Reportedly Orders 3M TPUs, NVIDIA Evaluates 18A for Multi-Die GPUs 2026-06-09 Semiconductors editor News Please note that this article cites information from The Information, Reuters, The Bull.com, Guru Focus, Wccftech, Futu News, Commercial Times, and Tom’s Hardware. Amid mounting capacity constraints and a widening shift among leading AI pl

Intel is putting its 18A node into the data center with new Xeon 6+ Clearwater Forest CPUs, which pack up to 288 E-cores for dense compute.

(Un)officially delayed to 2027, Venice comes first.

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