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Reveal Delivers Faster Seismic Workloads On Arm-based NVIDIA Grace Hopper Platform - Ocean News & Technology

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oceannews.com 2026-08-17

Applied Materials Tops Revenue Outlook but Shares Slip; SMIC Posts Robust Q2 Growth - StockInvest.us

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stockinvest.us 2026-08-14

In the recent semiconductor earnings season, Applied Materials demonstrated strong market performance with revenue guidance exceeding expectations, yet its stock price declined. This phenomenon reflects investors' complex attitudes toward the semiconductor industry's future growth prospects. Applied

Semiconductor Equipment Revenue Outlook Stock Performance SMIC Applied Materials Quarterly Earnings Semiconductor Industry Chip Manufacturing

Applied Materials Slips Despite Strong Outlook as SMIC Rallies on Earnings: Dow Jones, S&P, Nasdaq, Wall Street Futures - Yahoo Finance

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finance.yahoo.com 2026-08-14

Despite issuing stronger-than-expected fourth-quarter revenue guidance, Applied Materials (AMAT) saw its stock decline, reflecting investor skepticism amid elevated expectations for AI-related companies. Meanwhile, SMIC surged on improved Q2 results, bolstering the broader Asian semiconductor sector

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Applied Materials reports; SMIC rallies - what’s moving markets - Investing.com

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www.investing.com 2026-08-14

Chinese chipmaker SMIC increases prices on strong AI demand - Reuters

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news.google.com 2026-08-14

SMIC profit more than triples on AI-driven chip demand - Reuters

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www.reuters.com 2026-08-13

SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV

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tomshardware.com 2026-07-21

Recent teardown analysis by SemiAnalysis of Huawei's Kirin 9030 chip revealed that SMIC's third-generation 7nm process (N+3) achieves a smaller metal pitch than Intel's 18A and surpasses TSMC's N6 in transistor density, despite not using EUV lithography. However, this does not make SMIC's N+3 proces

SMIC TSMC Intel Semiconductor Process 7nm Technology Metal Pitch Transistor Density EUV Lithography

SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV — analysis of N+3 shows significant advancement for Chinese semi manufacturing - Tom's Hardware

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www.tomshardware.com 2026-07-21

SemiAnalysis reveals that SMIC's N+3 node matches TSMC's N6 density without EUV. - KuCoin

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www.kucoin.com 2026-07-21

Kirin 9030 In-Depth Analysis Proves SMIC Can Create Denser SoCs Than Intel Has With Its 18A Node, But The Attributes That Require Improvements Are Left Out - Wccftech

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wccftech.com 2026-07-21

Commentary: China's AI chip race leaves 15 chipmakers chasing SMIC's 7nm capacity

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digitimes.com 2026-07-09

Former SMIC CEO targets China photomask IPO after 12-inch wafer bet

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digitimes.com 2026-06-24

Why SMIC’s 14 nm FinFET process quietly powers everyday chips - AD HOC NEWS

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www.ad-hoc-news.de 2026-06-18

While not as headline-grabbing as TSMC's 3nm process, SMIC's 14nm FinFET technology serves as a crucial workhorse in China's growing semiconductor ecosystem. It powers everyday devices like smartphones, IoT gadgets, and industrial chips, offering a balance of performance, cost, and domestic supply.

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SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain

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digitimes.com 2026-06-18

Chinese fab SMIC's 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei's sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis's new teardown lab

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tomshardware.com 2026-06-16

SMIC's third-generation 7nm process achieves a metal pitch of 32.5nm, surpassing Intel's 18A node at 36nm, but overall transistor density lags by 38%. This finding comes from SemiAnalysis's first teardown from its new in-house lab, analyzing the HiSilicon Kirin 9030 chip found in Huawei's Mate 80. D

SMIC Huawei Kirin 9030 Semiconductor Process 7nm Node Metal Pitch Intel 18A Chip Teardown

Cosmic brings its latest high-power semiconductor testing platforms to PCIM Europe 2026 - Electronics360

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electronics360.globalspec.com 2026-06-05

Cosmic's unveiling of its latest high-power semiconductor testing platforms at PCIM Europe 2026 represents a significant advancement in semiconductor testing technology. As the premier global exhibition for power electronics, semiconductor, and energy management technologies, PCIM Europe provides a

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Commentary: TSMC Arizona profit tops SMIC and UMC combined, fueled by three key drivers - digitimes

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www.digitimes.com 2026-05-19

SMIC Shuffles Capacity to Meet Higher Power and Analog Chip, and Advanced Packaging AI Demand - Morningstar

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www.morningstar.com 2026-05-15

China's SMIC says foreign clients shifting orders back to China - Reuters

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www.reuters.com 2026-05-15

SMIC leverages process flexibility to capture orders amid global foundry capacity squeeze - digitimes

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www.digitimes.com 2026-05-15

SMIC demonstrated its strategic response to global market dynamics shifts during its Q1 2026 earnings Q&A session. Amid global foundry capacity constraints, SMIC leveraged its process flexibility to secure significant orders. This approach highlights Chinese semiconductor manufacturers' adaptability

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