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Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNewsreported, citing industry sources.

Synopsys said growing demand for artificial intelligence chips from semiconductor companies and hyperscale data center operators is driving broader adoption of its electronic design automation (EDA), hardware-assisted verification, and intellectual property (IP) products, supporting a higher fiscal 2026 revenue outlook and reinforcing the company's position in AI-related semiconductor development.

Synopsys said the rise of agentic artificial intelligence and the integration of Ansys are creating new growth opportunities across electronic design automation (EDA) and simulation software, as semiconductor and industrial customers adopt more complex AI-driven engineering workflows.

Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.

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The telecom sector's survival hinges on rapid software automation to counteract soaring hardware costs fueled by the booming AI demand.