Feed Deep Dive Matrix Subscribe About

Semiconductor News & Analysis Feed

6 articles
Trending Companies
NVIDIA15 TSMC7 Samsung6 Micron Technology4 Microsoft3 Amazon3 ASML3 Huawei3 AMD3 SK Hynix3 Apple2 Cornerstone Financial Management LLC2
Trending Technologies
EUV15 3nm12 AI accelerators4 AI chips3 high-bandwidth memory3 AI3 LLM2 data centers2 EUV lithography2 DUV lithography2 photolithography systems2 GPU2
2026-07-31
Powertech bets on AMD FOPLP mass production in 2027
0.92
digitimes.com 2026-07-31
2026-07-28
Powertech Technology: Record quarterly results with robust growth in memory and logic, led by AI and advanced packaging - TradingView
0.95
news.google.com 2026-07-28
2026-07-28
Broadcom Inks Deals With Samsung, Powertech - Semiecosystem
0.9
news.google.com 2026-07-28
2026-07-17
Powertech Technology Invests $400 Million in Singapore Joint Venture with Broadcom to Target AI Panel-Level Advanced Packaging - finance.biggo.com
0.95
finance.biggo.com 2026-07-17
2026-07-17
Powertech and Broadcom expand AI ASIC push with US$400M Singapore FOPLP venture
0.92
digitimes.com 2026-07-17
2026-05-25
[News] AMD Zen 7 Reportedly Built on TSMC A14 Node as Powertech’s FOPLP Packaging Said to Be Under Evaluation - TrendForce
0.92
www.trendforce.com 2026-05-25
According to reports from Commercial Times and TweakTown, AMD’s next-generation Zen 7 processor is expected to be manufactured using TSMC’s A14 process node, with Powertech Technology’s fan-out panel-level packaging (FOPLP) under evaluation. This development underscores AMD’s pursuit of advanced man
AMD Zen 7TSMCA14 nodePowertechFOPLP packaging3D V-CacheCPU architecturesemiconductor supply chain