[News] Samsung, NVIDIA Deepen Ties as Talks Reportedly Expand to HBM5 Next Year and Next-Gen Groq Chips - TrendForce

Recent reports from multiple South Korean media outlets indicate that Samsung Electronics and NVIDIA are deepening their semiconductor collaboration. Following NVIDIA CEO Jensen Huang’s visit to South... Read original →

Samsung and NVIDIA’s deepening alliance reflects a strategic realignment amid the AI compute arms race. Technically, co-developing HBM5 alongside 4nm/8nm logic nodes pressures SK hynix to fast-track HBM4E and forces TSMC (Taiwan, China) to build new moats beyond CoWoS packaging. From a compliance standpoint, tighter U.S. export controls on advanced fab equipment mean Samsung must reassess geopolitical exposure across its Xi’an and Austin foundries if it scales LPU production for NVIDIA. In market response, SK hynix may undercut HBM4 pricing to retain share, while TSMC leverages the Drive AGX Thor platform to lock in automotive collaboration. Over the next 12–24 months, this partnership will accelerate memory-logic co-design, cementing SOCAMM2 and PCIe Gen6 as AI server standards and driving LPDDR5X into edge inference—creating an end-to-end stack from cloud training to on-device execution.