Semiconductor News & Analysis Feed
19 articles
2026-08-25
www.tomshardware.com
2026-08-25
2026-08-05
www.igorslab.de
2026-08-05
2026-07-27
news.google.com
2026-07-27
2026-07-27
news.google.com
2026-07-27
2026-07-27
news.google.com
2026-07-27
2026-07-27
news.google.com
2026-07-27
2026-07-17
2026-07-14
news.google.com
2026-07-14
2026-07-02
www.trendforce.com
2026-07-02
As the semiconductor industry advances toward higher-layer HBM technologies, Samsung has filed a new patent aimed at enhancing the reliability of high-stack memory packaging. The patent focuses on addressing warpage issues in the topmost dummy die of HBM stacks with 12 or more layers, which signific
2026-06-09
www.trendforce.com
2026-06-09
Recent reports from multiple South Korean media outlets indicate that Samsung Electronics and NVIDIA are deepening their semiconductor collaboration. Following NVIDIA CEO Jensen Huang’s visit to South Korea, Samsung’s Vice Chairman Jun Young-hyun met with Huang to discuss cooperation in high-bandwid
2026-06-09
2026-06-03
tomshardware.com
2026-06-03
At Computex 2026 in Taipei, Samsung unveiled its first physical mockup of High-Bandwidth Memory 5 (HBM5), featuring a novel in-package cooling structure called the Heat Path Block (HPB). This design addresses the thermal bottleneck at the die-to-die interface, a critical issue as memory stacks grow
2026-06-02
biz.chosun.com
2026-06-02
At the 2026 Computex trade show in Taipei, South Korea's leading memory chipmakers Samsung Electronics and SK Hynix clashed for dominance in high-bandwidth memory (HBM), a critical component in the era of artificial intelligence. Samsung unveiled its next-generation HBM5 and new thermal management t
2026-06-02
www.asiae.co.kr
2026-06-02
2026-05-27
www.techtimes.com
2026-05-27
SK hynix unveiled its innovative iHBM (Integrated High Bandwidth Memory) technology on May 26, 2026, addressing a persistent performance bottleneck in high-bandwidth memory (HBM) used in AI data centers. By embedding proprietary cooling elements directly within the HBM package at the die-to-die phys
2026-05-27
www.techtimes.com
2026-05-27
SK hynix announced its innovative iHBM (Integrated High Bandwidth Memory) technology on May 26, 2026, which reduces thermal resistance by over 30% by embedding proprietary cooling elements directly within the HBM package. This breakthrough addresses persistent heat buildup in AI data center hardware
2026-05-26
www.tomshardware.com
2026-05-26
2026-05-26
www.trendforce.com
2026-05-26
2026-05-26
biz.chosun.com
2026-05-26
SK hynix has unveiled its next-generation high bandwidth memory (HBM) technology, iHBM, aimed at addressing the heat dissipation challenges associated with increasing AI computing performance. By embedding an integrated cooling element (ICE) made of high thermal conductivity, non-conductive silicon