Semiconductor News & Analysis Feed
20 articles
2026-08-19
www.streetinsider.com
2026-08-19
2026-08-19
www.bdtonline.com
2026-08-19
2026-08-19
www.enidnews.com
2026-08-19
2026-08-19
www.voiceofalexandria.com
2026-08-19
2026-08-19
news.google.com
2026-08-19
2026-08-17
semiengineering.com
2026-08-17
2026-08-03
www.digitimes.com
2026-08-03
2026-08-03
2026-07-31
www.thelec.net
2026-07-31
Samsung Electronics has encountered setbacks in its next-generation gallium nitride (GaN) power semiconductor foundry project, with reliability issues emerging during trial production that may delay commercialization beyond this year. According to industry sources, Samsung established an 8-inch GaN
2026-07-23
www.electropages.com
2026-07-23
2026-07-15
www.indexbox.io
2026-07-15
2026-07-02
www.trendforce.com
2026-07-02
As the semiconductor industry advances toward higher-layer HBM technologies, Samsung has filed a new patent aimed at enhancing the reliability of high-stack memory packaging. The patent focuses on addressing warpage issues in the topmost dummy die of HBM stacks with 12 or more layers, which signific
2026-06-29
news.google.com
2026-06-29
2026-06-23
chargedevs.com
2026-06-23
JEDEC's release of two SiC reliability guidelines represents a significant advancement in power conversion technology. As the electric vehicle market expands and demand for efficient power management increases, SiC technology has become a critical focus area for the semiconductor industry. These new
2026-06-16
militaryembedded.com
2026-06-16
As the space and defense sectors increasingly demand high-performance computing and real-time data processing, the need for efficient, reliable, and compact power devices has become critical. Gallium nitride (GaN) high-electron mobility transistors (HEMTs) are emerging as a transformative technology
2026-06-04
news.google.com
2026-06-04
2026-06-04
www.eenewseurope.com
2026-06-04
JEDEC has released two new guideline documents to support the growing adoption of silicon carbide (SiC) power semiconductors across applications from electric vehicles to industrial power systems. These publications, JEP203 and JEP204, were developed by the JC-70.2 Silicon Carbide Subcommittee and a
2026-06-04
semiengineering.com
2026-06-04
As the automotive industry transitions from software-defined vehicles (SDVs) to AI-defined vehicles (AIDVs), the demand for reliable and secure automotive Ethernet is intensifying. AIDVs require low-latency, deterministic communication to support critical functions such as autonomous driving, in-veh
2026-06-04
www.01net.it
2026-06-04
JEDEC has released new SiC device guidelines to enhance reliability and evaluation standards in power electronics, marking a significant advancement in semiconductor technology for high-performance power devices. This technical standard addresses the growing demand for efficient power electronics in
2026-06-03
www.standard-journal.com
2026-06-03
On June 3, 2026, JEDEC Solid State Technology Association, the global leader in microelectronics standards development, released two new guidelines for silicon carbide (SiC) devices: JEP203, 'Guideline for Short Circuit Evaluation in Power Conversion Transistors,' and JEP204, 'Catalog of Stress Proc