[News] Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows - TrendForce

As AI chips continue to scale in size and complexity, demand for next-generation packaging solutions is rising, with glass substrates emerging as a key technology. According to reports, glass substrat... Read original →

Glass substrates represent not just a material swap but a systemic overhaul of the advanced packaging stack. Their 310×310 mm form factor enables EUV compatibility and silicon photonics integration, forcing equipment vendors to upgrade alignment precision and thermal control—while alleviating CoWoS cost pressures from silicon interposers. Although TSMC in Taiwan, China leads with CoPoS pilot runs, SKC’s vertical integration within Korea’s supply chain may let it dominate standard-setting during the critical 2027–2028 window. Geopolitical risk looms: core glass materials and coating tech remain concentrated in Japanese and U.S. firms; any export controls could trigger hyperscalers like NVIDIA to fast-track multi-source validation. Over the next 18 months, Intel and Samsung Electro-Mechanics will likely forge domestic material alliances to build 'Taiwan-decoupled' packaging routes, while LG Innotek targets North American AI server supply chains for second-tier breakthrough.