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ASML, TSMC, and imec have jointly demonstrated a scalable 300mm integration route for 2D-material-based transistors, marking a significant step toward industrial adoption. At the 2026 IEEE/JSAP VLSI Symposium, they presented nFETs and pFETs using transition-metal dichalcogenides (TMDs) such as MoS2,

2D materials transistor silicon technology semiconductor manufacturing EUV lithography TSMC ASML imec

Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer - Tom's Hardware

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www.tomshardware.com 2026-06-19

imec, ASML, and TSMC have achieved a significant breakthrough in 2D transistor technology, demonstrating complementary n- and p-type transistors with atomically thin channels on a 300mm wafer at a 50nm contacted poly pitch. Presented at the IEEE/JSAP Symposium on VLSI Technology and Circuits, the wo

2D materials transistor technology EUV lithography post-silicon era semiconductor manufacturing TSMC imec ASML

Imec unlocks system-level III-V chiplet integration on Si-CMOS - Evertiq

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evertiq.com 2026-06-18

Imec, a Belgian research center in nanoelectronics and digital technologies, has unlocked system-level integration of III-V chiplets on Si-CMOS. By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding, the platform enables next-

III-V chiplets chiplet integration Si-CMOS RF integration wireless communication mmWave sub-THz capacitor integration

Imec, Sony unveil backside interconnect method for 3D chip stacking

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digitimes.com 2026-06-18

TSMC, ASML and Imec push 2D transistors toward manufacturing

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digitimes.com 2026-06-18

ASML, TSMC, and imec move 2D transistors closer to manufacturing reality - digitimes

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www.digitimes.com 2026-06-16

ASML, TSMC, and imec have achieved a significant breakthrough in advancing two-dimensional (2D) semiconductor materials from laboratory research to high-volume manufacturing. This collaboration represents a crucial step toward commercializing 2D materials, which offer unique electronic properties fo

2D semiconductors Semiconductor manufacturing EUV lithography Advanced process Chip technology Semiconductor materials Wafer fabrication Technology breakthrough

ASML, TSMC, and imec move 2D transistors closer to manufacturing reality

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digitimes.com 2026-06-16

ASML, TSMC, and imec Achieve 300 mm Integration of 2D-Material Transistors with 50 nm Pitch - TechPowerUp

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www.techpowerup.com 2026-06-16

The semiconductor industry has achieved a significant breakthrough with ASML, TSMC, and imec jointly realizing the integration of 2D material transistors on 300mm wafers with a 50nm pitch. This advancement represents a crucial step forward in advanced manufacturing processes, addressing fundamental

2D materials Transistor technology Semiconductor manufacturing ASML TSMC imec 300mm wafer 50nm pitch

Imec Pushes Quantum Toward Manufacturable Silicon Systems

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eetimes.com 2026-06-15

At ITF World 2026, imec unveiled the world’s first quantum dot qubit device fabricated using High-NA EUV lithography, marking a significant step toward manufacturable quantum systems. The demonstration achieved gate spacings of approximately 6 nm—just a few dozen silicon atoms—using EUV techniques,

Quantum Computing Semiconductor Manufacturing EUV Lithography Silicon Quantum Dots Qubit CMOS Process Quantum System Engineering High-NA EUV

ASML, TSMC and Imec scale 2D transistors to 50nm pitch on 300mm wafers - Bits&Chips

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bits-chips.com 2026-06-15

ASML, TSMC, and imec have achieved scalable 2D transistor manufacturing on 300mm wafers with a 50nm pitch, marking a significant step toward industrial adoption of post-silicon logic devices. Presented at the 2026 IEEE/JSAP VLSI Symposium, the demonstration features both nFETs and pFETs using a CMOS

2D materials transistor manufacturing EUV lithography CMOS technology semiconductor fabrication wafer manufacturing transition metal dichalcogenides IC design

Imec advances III-V chiplet integration with RF silicon interposer - eeNews Europe

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www.eenewseurope.com 2026-06-12

Belgian research hub imec has made significant progress in chip integration technology, extending its 300mm RF silicon interposer platform to enable system-level integration of III-V chiplets with Si-CMOS technology. This advancement addresses emerging mmWave and sub-THz wireless applications, as we

Semiconductor Technology Chip Integration III-V Materials Silicon Interposer RF Chip Chip Packaging Wireless Communication Data Center

Imec advances platform for integrating III‑V chiplets with Si‑CMOS - New Electronics

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www.newelectronics.co.uk 2026-06-12

Imec's advancement in III-V chiplet integration with Si-CMOS represents a significant breakthrough in semiconductor technology, addressing long-standing challenges in hetero-integration. The platform enables seamless connection between III-V compound semiconductors and traditional silicon CMOS proce

Semiconductor Technology Chip Integration III-V Materials Si-CMOS Process Chiplets Integrated Circuits Semiconductor R&D Chip Manufacturing

imec Unveils Quantum Dot Qubit Device Using High NA EUV Lithography - EE Times India

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news.google.com 2026-05-25

Imec Says AI Scaling Needs More Orchestration Across Research, Design, Manufacturing

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eetimes.com 2026-05-22

At the ITF World 2026 conference, imec CEO Patrick Vandenameele used the analogy of an orchestra to emphasize the complexity of scaling AI, highlighting the need for coordination across research, design, and manufacturing. He likened AI to a violin in an orchestra, underscoring that while AI is capt

AI Scaling Semiconductor Industry Technology Orchestration System Design Manufacturing AI Infrastructure Chip Design Industry Collaboration

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