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Arteris launches FlexGen Multi-Die for AI chiplets - DataCenterNews Asia Pacific

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datacenternews.asia 2026-10-02

Cadence and TSMC Expand Certified AI and HPC Flows Across Advanced Nodes, Chiplets and 3D-IC - EE Times Asia

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news.google.com 2026-09-29

Heterogeneous Memory Chiplets Accelerate Multi-Request LLM Inference (NUS) - Semiconductor Engineering

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news.google.com 2026-09-12

CPO Is Not the Endgame: Tower Bets on 3D Optical Engines and Optical I/O Chiplets - semivision

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tspasemiconductor.substack.com 2026-09-10

As AI infrastructure scales rapidly, the semiconductor industry is undergoing a significant structural transformation. While past discussions around AI chips centered on GPUs, ASICs, HBM, and advanced logic nodes like 3nm and 2nm, the primary system bottleneck is shifting from computational speed to

AI Infrastructure Optical Interconnect Silicon Photonics 3D Integration Optical Engine Optical I/O Chiplets Optical Communication Semiconductor Manufacturing

SiliconAuto pushes AI chiplets as automotive SoC ties tighten

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digitimes.com 2026-09-07

Hot Chips 2026: Arm details AGI server CPU with two 70-core N3P chiplets — touts 2 TB/s UCIe fabric link and 12-channel memory controller - Tom's Hardware

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www.tomshardware.com 2026-08-26

Intel Deep Dives 256-Core Diamond Rapids With 16 Core Chiplets & Huge Cache - HotHardware

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hothardware.com 2026-08-25

Intel unveiled its next-generation Xeon 7 Diamond Rapids processor at Hot Chips 2026, featuring a revolutionary chiplet-based architecture with up to 256 performance cores and 1.28GB of shared L3 cache. The design uses 16 compute chiplets fabricated on the 18A-P process node, stacked vertically usin

Intel Xeon 7 Diamond Rapids chiplet architecture 3D packaging cache hierarchy AI workloads data center CPU

Arm's AGI CPU Packs Over 100 Billion Transistors Into Two Chiplets - XenoSpectrum

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xenospectrum.com 2026-08-25

Arm Dissects Its AGI CPU Which Is Tailor-Made For AI: Dual Chiplets With >100B Transistors, 136 Neoverse V3 Cores, Driving A $2B Demand In 2027-2028 - Wccftech

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news.google.com 2026-08-24

Chiplets Offer a Scalable Compute Strategy for Software-defined Vehicles - EE Times Asia

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news.google.com 2026-08-18

Guotai Haitong: As Moore's Law slows, chiplets and advanced packaging emerge as alternative solutions for further performance enhancement - Moomoo

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www.moomoo.com 2026-08-13

Chiplets Market Size to Reach US$507.2 Billion by 2033, Driven by AI, HPC, and Advanced Packaging Growth - EIN News

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www.einnews.com 2026-08-06

Chiplets Market Size to Reach US$507.2 Billion by 2033, Driven by AI, HPC, and Advanced Packaging Growth - EIN Presswire

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news.google.com 2026-08-06

Why Simulation Speed Is Holding Chiplets Back - Semiconductor Engineering

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semiengineering.com 2026-07-23

TYL Semi De-Risks Chiplets With New Business Model

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eetimes.com 2026-07-16

TYL Semi has raised $43 million in seed funding to launch a new fabless semiconductor business model aimed at reducing risks for AI infrastructure builders using chiplet-based designs. By integrating surrounding chiplets, packaging, and testing, TYL Semi offers end-to-end silicon solutions to custom

Chiplets Semiconductor Design AI Infrastructure Supply Chain Risk Fabless Model Chip Packaging Chip Testing Custom Silicon

TYL Semi De-Risks Chiplets With New Business Model - EE Times

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www.eetimes.com 2026-07-16

SiPearl CEO Philippe Notton on Europe's AI processors, chiplets, and semiconductor sovereignty - eeNews Europe

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www.eenewseurope.com 2026-07-11

Exclusive CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets - All About Circuits

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www.allaboutcircuits.com 2026-06-29

Rebellions' new Neural Processing Unit (NPU) leverages memory-centric chiplet technology, representing a significant advancement in the semiconductor industry. This innovative architecture addresses traditional memory bottlenecks by tightly integrating memory and computing units, delivering substant

Semiconductor Industry AI Chip NPU Chiplet Technology Memory-Centric Computing Artificial Intelligence Chip Design Semiconductor Manufacturing

Wafer-Scale vs. Chiplets: The New War? Part 2 - Semiconductor Engineering

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semiengineering.com 2026-06-25

In the evolving semiconductor landscape, wafer-scale integration and chiplet technologies are emerging as two promising architectural approaches. This article delves into the Cerebras WSE-3's wafer-scale approach, highlighting its key innovation in eliminating data movement overhead at the architect

Wafer-scale integration Chiplets Computing architecture Data movement bottleneck HBM stacking Interconnect topology Energy efficiency Heterogeneous integration

Ebook: Cadence Chiplets Solutions: Helping you realize your chiplet ambitions - EE Times

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news.google.com 2026-06-18

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