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2026-08-21
Micron Establishes Boise Research Hub for Memory and AI - HPCwire
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www.hpcwire.com 2026-08-21
2026-08-20
Micron to Build $10B Memory Research Network Based in Boise - HPCwire
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www.hpcwire.com 2026-08-20
2026-08-19
Coherent Begins Customer Sampling of 300mm High Thermal Conductivity SiC Substrates for AI Infrastructure - hpcwire.com
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news.google.com 2026-08-19
2026-08-18
Credo Proposes Open Chiplet Interconnect Standard for AI Systems - HPCwire
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www.hpcwire.com 2026-08-18
2026-08-17
NVIDIA Invests $1.5B in SB Energy, Secures Ohio AI Infrastructure for OpenAI - hpcwire.com
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www.hpcwire.com 2026-08-17
2026-08-08
Microchip and Micron Bet AI’s Next Infrastructure Battle Will Be Storage - HPCwire
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news.google.com 2026-08-08
2026-08-06
Chiplets Market Size to Reach US$507.2 Billion by 2033, Driven by AI, HPC, and Advanced Packaging Growth - EIN News
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www.einnews.com 2026-08-06
2026-08-06
Chiplets Market Size to Reach US$507.2 Billion by 2033, Driven by AI, HPC, and Advanced Packaging Growth - EIN Presswire
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news.google.com 2026-08-06
2026-08-05
From chip design to HPC readiness: How EUPEX is shaping Europe’s HPC future - Innovation News Network
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www.innovationnewsnetwork.com 2026-08-05
2026-08-05
DDN Collaborates with NVIDIA to Advance GPU-Initiated Data Access for Next-Gen AI - HPCwire
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www.hpcwire.com 2026-08-05
2026-08-05
SK hynix Unveils 1st HBF Standard Specifications with Sandisk at FMS 2026 - HPCwire
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www.hpcwire.com 2026-08-05
2026-07-31
SimOps Framework Reveals Strong Alignment Across Synopsys HPC-Powered Simulation Offerings - HPCwire
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www.hpcwire.com 2026-07-31
2026-07-30
Openchip Introduces BER10 RISC-V Chip Built for AI, HPC and Critical Infrastructure - HPCwire
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www.hpcwire.com 2026-07-30
2026-07-29
Cadence Certifies AI-Driven Reference Flows for Intel 18A-P and Intel 14A - HPCwire
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www.hpcwire.com 2026-07-29
Cadence's certification of AI-driven reference flows for Intel's 18A-P and 14A process technologies represents a significant advancement in semiconductor manufacturing and AI chip design. These advanced process nodes, at 18nm and 14nm respectively, provide the foundation for high-performance computi
Semiconductor ManufacturingAI Chip DesignReference Flow CertificationIntel Process TechnologyCadenceChip Design ToolsHigh Performance ComputingAdvanced Process
2026-07-28
Synopsys Advances Agentic AI Chip Design with AMD and Microsoft - HPCwire
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news.google.com 2026-07-28
2026-07-24
AMD Takes On Nvidia with MI455 GPUs and Helios Racks - HPCwire
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www.hpcwire.com 2026-07-24
AMD's launch of MI455 GPUs and Helios racks represents a significant challenge to NVIDIA's dominance in high-performance computing. This strategic move demonstrates AMD's growing capabilities in AI and data center markets, directly competing with NVIDIA's established position. The MI455 GPU, built o
AMDNVIDIAGPUHigh Performance ComputingData CenterAI ChipSemiconductorServer
2026-07-22
Ambiq and ChipAgents Collaborate to Advance Agentic AI for Semiconductor Engineering - HPCwire
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www.hpcwire.com 2026-07-22
Ambiq and ChipAgents have announced a strategic partnership to advance agentic AI technology in semiconductor engineering, marking a significant step toward AI integration in the semiconductor industry. Agentic AI enables autonomous execution of complex tasks including chip design optimization, manu
Semiconductor EngineeringArtificial IntelligenceAgentic AIChip DesignSecurity VerificationTechnology CollaborationAI ChipsSemiconductor Manufacturing
2026-07-21
Microsoft, AMD Introduce New Azure VMs for AI, HPC, and Chip Design - Petri IT Knowledgebase
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petri.com 2026-07-21
2026-07-21
Charting RISC-V’s Future in HPC - HPCwire
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www.hpcwire.com 2026-07-21
2026-07-17
TSMC confirms significant yield and performance improvements in A14 update — strong interest from AI/HPC and smartphone customers - Tom's Hardware
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www.tomshardware.com 2026-07-17