Semiconductor News & Analysis Feed
73 articles
2026-07-07
digitimes.com
2026-07-07
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissip
2026-07-06
digitimes.com
2026-07-06
Rising demand for AI servers and high-performance computing (HPC) continues to drive price increases across the upstream PCB materials supply chain.
2026-07-05
digitimes.com
2026-07-05
Test interface supplier Chunghwa Precision Test Tech. Co., Ltd. (CHPT) reported its June 2026 revenue, marking its sixth consecutive monthly revenue record as demand from the market remained strong. The company also posted record quarterly revenue in both the first and second quarters of 2026, underscoring its sustained growth momentum.
2026-07-04
digitimes.com
2026-07-04
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for the semiconductor and PCB inspection equipment maker. The company said the biggest challenge has now shifted from winning orders to managing supply chains and expanding capacity.
2026-07-02
www.koreaherald.com
2026-07-02
The Korea Herald
2026-07-01
www.indexbox.io
2026-07-01
IndexBox
2026-06-29
www.hpcwire.com
2026-06-29
HPCwire
www.hpcwire.com
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2026-06-27
digitimes.com
2026-06-27
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
2026-06-25
www.hpcwire.com
2026-06-25
HPCwire
www.hpcwire.com
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2026-06-25
www.indexbox.io
2026-06-25
IndexBox
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2026-06-25
semiengineering.com
2026-06-25
Liz Allan
Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnec...
2026-06-24
www.hpcwire.com
2026-06-24
HPCwire
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2026-06-24
www.hpcwire.com
2026-06-24
HPCwire
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2026-06-24
www.hpcwire.com
2026-06-24
HPCwire
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2026-06-23
www.hpcwire.com
2026-06-23
HPCwire
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2026-06-23
www.nextplatform.com
2026-06-23
The Next Platform
AMD And Nvidia Are Neck In HPC Supercomputing
Timothy Prickett Morgan
Co-Editor, Co-Founder, The Next Platform
Published Tue 23 Jun 2026 // 13:25 UTC
Necessity is always the mother of invention, and if you are trying to create an indigenous compute engine design and manufacturing capability, as China certainly is, then it stands to reason that the Middle Kingdom’s eight national computing centers
2026-06-23
manilastandard.net
2026-06-23
Manila Standard
TECHNOLOGY
Last updated June 23, 2026, 7:32 PM
Cadence announces collaboration with Intel Foundry to accelerate Intel 14A process optimization for HPC and mobile designs
By Manila Standard - Tech
June 23, 2026, 7:31 PM
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Expanded cooperation spans DTCO, IP readiness and design enablement to advance next-generation customer innov
2026-06-23
www.hpcwire.com
2026-06-23
HPCwire
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2026-06-23
www.networkworld.com
2026-06-23
Network World
Nvidia packs Vera CPUs, Rubin GPUs, networking technologies, and software into a rack-mounted supercomputer.
Credit: Nvidia
Nvidia has formally launched the Vera Rubin platform, a combination CPU and GPU platform billed as a major step forward in the convergence of artificial intelligence and high-performance computing (HPC) for scientific research.
Announced at the ISC High Performance 2026 co
2026-06-22
www.hpcwire.com
2026-06-22
HPCwire
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