__fail__

Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng

AMD to invest more than $10 billion in Taiwan ecosystem, ramping HPC chips on TSMC’s 2-nm process amid AI buildout.

__fail__

__fail__

__fail__

__fail__

Singapore-based AI automation startup Galatek said it is tackling yield bottlenecks in micron-level packaging with AI-embedded equipment as demand for AI and high-performance computing (HPC) chips surges across Southeast Asia and global markets. The company is also pursuing a dual-track expansion spanning Southeast Asia and Taiwan.

Taiwan's semiconductor testing and probe card supply chain maintained solid momentum entering 2026, driven by continued AI accelerator, high-performance computing (HPC), and advanced packaging demand.

__fail__

__fail__

Semiconductor test interface provider Chunghwa Precision Test Tech (CHPT) said its revenue in April 2026 continued to set a new all-time monthly high, driven by rising demand for semiconductor testing linked to artificial intelligence (AI) applications.