Semiconductor News & Analysis Feed

Kevin Zhang said 3D integration is important, but transistor scaling remains the semiconductor industry's primary driver of performance and energy-efficiency gains.

By Eduardo Baptista and Che Pan BEIJING, May 29 (Reuters) – Huawei’s new chip design principle focused on boosting transmission speed rather than continuing to shrink semiconductors offers a path for China to build cutting-edge chips despite U.S. sanctions, though whether it represents a true breakthrough remains to be seen. China has been barred since 2019 from importing ASML’s most advanced ex

By Eduardo Baptista and Che Pan BEIJING, May 29 (Reuters) – Huawei’s new chip design principle focused on boosting transmission speed rather than continuing to shrink semiconductors offers a path for China to build cutting-edge chips despite U.S. sanctions, though whether it represents a true breakthrough remains to be seen. China has been barred since 2019 from importing ASML’s most advanced ex

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Future Electronics Features Infineon CoolGaN™ Transistors & GaN-Based Solutions for Humanoid Robotics 59 mins ago Facebook Twitter Email Facebook Twitter Email Print Copy article link Save Future Electronics, a global leader in electronic components distribution, is highlighting Infineon Technologies AG CoolGaN™ transistors and GaN-based solutions engineered to support the growing demands of huma

Huawei's answer to Moore's Law without EUV promises 14A performance by 2031.

As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.

Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture

Tech Industry Manufacturing Semiconductors Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law News By Etiido Uko published 11 hours ago Flagship Huawei Mate 90 series will be the first commercial processo

HUAWEI Huawei Kirin 2026 Chip: 238 MTr/mm2 transistor density rivaling TSMC’s 3nm Published 4 hours ago on May 25, 2026 By Deng Li Discover more Huawei FreeBuds Huawei software updates Vivo phone updates Huawei has revealed its Kirin 2026 details and it reveals massive upgrade in the chip arachitecture including transistor density. He Tingbo, Director and President of Semiconductor B

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As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor miniaturisation.

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