Semiconductor News & Analysis Feed
177 articles
2026-06-17
www.eurekalert.org
2026-06-17
EurekAlert!
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2026-06-17
www.newswise.com
2026-06-17
Newswise
Credit: Korea Institute of Machinery and Materials (KIMM)
Senior Researcher Hyeong-U Kim of the Semiconductor Manufacturing Research Center, Autonomous Manufacturing Research Division, Korea Institute of Machinery and Materials (KIMM)
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Newswise — A technology has been developed that enables artificial intelligence (AI) to autonomously analyze and control ultra-th
2026-06-17
digitimes.com
2026-06-17
Samsung Electro-Mechanics (Semco) is rapidly gaining ground in the silicon capacitor market as AI infrastructure investment and technology upgrades accelerate demand. After landing its first major silicon capacitor order, the company is in talks with additional potential customers, while its multilayer ceramic capacitor (MLCC) business is also expanding and operating profit is expected to hit a re
2026-06-17
digitimes.com
2026-06-17
InnoScience Technology, a leading China-based integrated device manufacturer (IDM) in gallium nitride (GaN), has won a sweeping victory in the latest patent ruling against global power component leader Infineon in China. Supply-chain sources said the two sides' GaN patent fight has stretched from the US and Germany to China, and the ruling makes it even harder for Infineon within China's increasin
2026-06-17
hothardware.com
2026-06-17
HotHardware
Leaked Intel SoC Plan Pairs x86 CPUs With NVIDIA RTX Integrated GPUs In Early 2028
by Zak Killian — Tuesday, June 16, 2026, 04:20 PM EDT
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We know Intel and NVIDIA are cooking up something together because the two companies announced that they would last year when NVIDIA invested $5 billion USD into Intel. The announcement included the statement that Intel would "build and offer to the ma
2026-06-17
www.constellationr.com
2026-06-17
Constellation Research
HPE tightens Nvidia ties in AI stack, integrates Juniper
PUBLISHED JUNE 16, 2026
HPE launched an updated AI factory stack on the latest Nvidia technologies including the Vera CPU, added features to HPE Private Cloud AI and integrated the Juniper networking portfolio as part of its self-driving network strategy.
The barrage landed as HPE Discover kicked off in Las Vegas. HPE delivered strong earn
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
www.digitimes.com
2026-06-16
digitimes
Murata Manufacturing has partnered with Synopsys to make its latest electromagnetic and thermal simulation models directly accessible through Synopsys' Ansys HFSS and Ansys Icepak environments, simplifying engineers' workflows as they develop increasingly...
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2026-06-16
digitimes.com
2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly
2026-06-16
simplywall.st
2026-06-16
simplywall.st
United States/Semiconductors/NasdaqGS:POWI
Does Power Integrations’ (POWI) Kyber-Optimized GaN Push Redefine Its High-Voltage AI Data Center Ambitions?
June 16, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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In June 2026, Power Integrations introduced two ultra-slim auxiliary power supply reference designs for 800 VDC AI data centers, including a 15 W single-output and a 35 W six-
2026-06-16
www.indexbox.io
2026-06-16
IndexBox
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2026-06-16
wccftech.com
2026-06-16
Wccftech
The compact space inside smartphones makes it difficult to adopt High Bandwidth Memory (HBM), not to mention the thermal problem, but a rumor claims that Chinese smartphone brands have a custom-made Low Latency Wide DRAM (LLW) that adopts a similar integrated design as the aforementioned technology. While the design isn’t “true HBM,” it aims to resolve the performance bottleneck issue that LPDDR R
2026-06-16
www.techpowerup.com
2026-06-16
TechPowerUp
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2026-06-15
eetimes.com
2026-06-15
Imec says advanced lithography and semiconductor integration techniques may help scale silicon spin qubits toward manufacturable quantum systems.
2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
simplywall.st
2026-06-15
simplywall.st
Japan/Semiconductors/TSE:8035
Is Tokyo Electron (TSE:8035) Quietly Redefining Its Chiplet Strategy With Teradyne Test Integration?
June 14, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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In June 2026, Teradyne announced an integrated test cell solution for AI and data center chips that combines its UltraFLEXplus platform with Tokyo Electron’s Prexa SDP prober to enable high-qualit
2026-06-14
zamin.uz
2026-06-14
Zamin.uz
Belkin introduces new 45W GaN charger with integrated cable
11:53 / 14.06.2026
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Technology
Belkin, a leading brand in the accessories market, has unveiled its new generation charger. Based on Gallium Nitride (GaN) technology, this gadget delivers 45 W of power and stands out not only for its compactness but also for its convenient integrated cable. This is reported by Ixbt.com reports .
C
2026-06-12
www.eenewseurope.com
2026-06-12
eeNews Europe
Belgian research hub Imec has taken another step toward high-frequency chiplet-based systems, extending its 300mm RF silicon interposer platform to support system-level integration of III-V chiplets with Si-CMOS technology. The development targets emerging mmWave and sub-THz wireless applications, as well as high-speed signal handling for next-generation data centers.
2026-06-12
www.newelectronics.co.uk
2026-06-12
New Electronics
www.newelectronics.co.uk
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