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Murata and Synopsys deepen simulation integration as electronics design complexity grows - digitimes

www.digitimes.com 2026-06-16 digitimes
Entities
Companies:MurataSynopsys
Tags
MurataSynopsysSimulation IntegrationElectronic DesignElectromagnetic SimulationThermal SimulationHFSSIcepakEngineering WorkflowSemiconductor DesignTechnology PartnershipDesign Complexity
News Summary
Murata Manufacturing and Synopsys have deepened their partnership to integrate the latest electromagnetic and thermal simulation models directly into Synopsys' Ansys HFSS and Ansys Icepak environments... Read original →
Industry Analysis
Murata and Synopsys’ deeper integration tackles the multi-physics coupling challenges from 5G mmWave and AI chips’ high power density. Technically, embedding Murata’s component models directly into HFSS and Icepak shifts EDA workflows from post-validation to ‘simulation-driven design,’ pressuring upstream IP vendors to standardize parasitic parameters. While not currently restricted under U.S. export controls, any tightening of EDA licensing to China could force Murata’s fabs in Suzhou and Wuxi to adopt localized simulation alternatives. Competitively, Ansys—bolstered by its Apache acquisition—and Keysight’s PathWave are vying for RF front-end dominance; Murata’s move secures early influence in high-end module design. Within 12–24 months, such closed-loop co-simulation capabilities will become table stakes for RF/power module suppliers, marginalizing smaller players lacking modeling ecosystems.
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