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2026-11-13
electronica 2026: Chipmakers Move Up the Stack as Data Centers and Physical AI Take Center Stage
0.8
eetimes.com 2026-11-13
2026-11-13
RISC-V SoCs Zero in on Physical AI Applications - Electronic Design
0.8
www.electronicdesign.com 2026-11-13
2026-11-12
Sungrow launches PowerStack 3.0 C&I storage with modular scenario dock and full SiC PCS - ESS News
0.9
www.ess-news.com 2026-11-12
2026-11-12
Connecting AI to the Physical World
0.75
eetimes.com 2026-11-12
2026-11-12
The Memory Challenge Of Physical AI
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semiengineering.com 2026-11-12
2026-11-12
onsemi unveils fourth-generation SiC platform targeting AI, EV and energy applications - New Electronics
0.95
www.newelectronics.co.uk 2026-11-12
2026-11-12
TSMC sees surging AI chip demand, highlights advanced packaging and physical AI opportunities
0.95
digitimes.com 2026-11-12
2026-11-12
Automotive Tech Forum: The Current State of Sic in EV Design and How It’s Evolving
0.95
eetimes.com 2026-11-12
2026-11-12
NXP CTO Lars Reger on Physical AI, Robots, Drones, and Trust
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eetimes.com 2026-11-12
2026-11-12
Nexperia Expands SiC Portfolio with 750 V Trench MOSFETs for High-efficiency Power Conversion Applications - NewswireToday
0.95
news.google.com 2026-11-12
2026-11-11
Nexperia expands SiC portfolio with 750V trench MOSFETs for high-efficiency power conversion - Semiconductor Today
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www.semiconductor-today.com 2026-11-11
2026-11-11
Smaller memory buyers 'basically shut out' of direct supply, Smith says
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digitimes.com 2026-11-11
2026-11-11
Infineon Produces Functional SiC Power Semiconductors on 300 mm Wafers for the First Time - igor´sLAB
0.95
www.igorslab.de 2026-11-11
2026-11-11
Infineon says it processed functional power devices on 300mm SiC wafers
0.95
digitimes.com 2026-11-11
2026-11-10
Infineon processes SiC on 300 mm wafers for the first time - electrive.com
0.95
www.electrive.com 2026-11-10
2026-11-10
onsemi's EliteSiC M4 Pushes Power Density Higher as Energy Demands Grow - Indovizka.com
0.95
indovizka.com 2026-11-10
2026-11-10
onsemi introduces EliteSiC M4 fourth-gen silicon carbide platform, with up to 30% higher power density and 35% lower losses - Semiconductor Today
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www.semiconductor-today.com 2026-11-10
2026-11-10
Infineon processes first 300 mm SiC wafers into working power devices - Evertiq
0.95
evertiq.com 2026-11-10
2026-11-10
Synopsys Advances Virtual Development of Next-Generation Automotive and Physical AI Applications with Infineon AURIX™ RC1 Microcontroller Family - Synopsys
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news.synopsys.com 2026-11-10
2026-11-10
Infineon Marks Innovation Milestone With World’s First 300-millimeter Power Silicon Carbide (SiC) Wafer - NewswireToday
0.95
www.newswiretoday.com 2026-11-10