Semiconductor News & Analysis Feed
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2026-06-17
wccftech.com
2026-06-17
Wccftech
The Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its supply chain for glass substrates as part of the first step of establishing a supply chain for the chip-on-panel-on-substrate (CoPoS) packaging technology, according to supply chain sources. The glass substrates will be used in the firm's advanced versions of the chip-on-wafer-on-substrate (CoWoS) packaging technology, and TSMC
2026-06-16
www.tomshardware.com
2026-06-16
Tom's Hardware
Tech Industry Manufacturing Semiconductors
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package
News
By Anton Shilov published 16 hours ago
CoPoS may enable larger chips, but CoWoS is still better.
(Image credit: Intel)
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2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
CoPoS may enable larger chips, but CoWoS is still better.
2026-06-16
letsdatascience.com
2026-06-16
Let's Data Science
INFRASTRUCTURE
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chip packaging
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TSMC highlights CoWoS strength over panel packaging for largest AI chips
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June 16, 2026
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At TSMC's European Technology Symposium, Kevin Zhang, TSMC's senior vice president of business development and global sales and deputy co-COO, said that panel-l
2026-06-16
www.digitimes.com
2026-06-16
digitimes
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC...
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2026-06-16
www.moomoo.com
2026-06-16
Moomoo
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2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
Capacity push for AI: TSMC’s CoWoS packaging ramps toward 140,000 wafers a month
16.06.2026 - 02:00:19 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging line is emerging as a quiet workhorse of the AI boom. Industry data now points to capacity as high as 120,000 to 140,000 wafers per month by 2026, as the Taiwanese foundry pours billions into a technology that has become critica
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
AI packaging push: how TSMC’s CoWoS advanced packaging is scaling for the next wave
15.06.2026 - 19:54:24 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging platform is at the center of the AI accelerator boom. Capacity for the 2.5D chip-on-wafer-on-substrate technology is ramping hard, with the foundry targeting well over 100,000 wafers per month as hyperscaler demand keeps clim
2026-06-15
www.moomoo.com
2026-06-15
Moomoo
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2026-06-15
www.trendforce.com
2026-06-15
TrendForce
[News] TSMC CoWoS Supply-Demand Gap Reportedly Seen Narrowing from 20% to 10% by End-2026
2026-06-15 Semiconductors editor
News
Please note that this article cites information from Economic Daily News, Reuters. and Commercial Times.
TSMC continues to accelerate its advanced packaging capacity expansion, helping move the industry closer to supply-demand balance. According to Economic Dail
2026-06-15
english.cw.com.tw
2026-06-15
天下雜誌
english.cw.com.tw
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2026-06-14
digitimes.com
2026-06-14
Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has recorded record-high revenue and gross margin in the first four months of 2026, boosted by rising demand in Industry 5.0 applications, advanced semiconductor process inspection, and AI data center optical communication. With short-wave infrared (SWIR) transmissive a
2026-06-11
wccftech.com
2026-06-11
Wccftech
With multiple supply chain reports focusing on Intel's EMIB-T chip packaging technology, analyst Ming-Chi Kuo has shared that TSMC's next-generation packaging technology, CoPoS, will enter mass production in 2028. CoPoS, short for chip-on-panel-on-substrate, seeks to overcome the limitations of the current CoWoS (chip-on-wafer-on-substrate) packaging technology by increasing the area on which the
2026-06-10
www.tomshardware.com
2026-06-10
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks
Features
By Anton Shilov published 4 hours ago
TSMC kicks off unprecedented capacity expansion plan.
(Image credit: Getty Images / Jimmy Beunardeau)
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Newslette
2026-06-05
www.trendforce.com
2026-06-05
TrendForce
[News] Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows
2026-06-05 Semiconductors editor
News
Please note that this article cites information from Sisa Journal, Economic Daily News, Commercial Times, Forbes and The Elec.
As AI chips continue to scale in size and complexity, demand is rising for next-generation packaging and substrate so
2026-06-02
news.futunn.com
2026-06-02
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2026-06-02
wccftech.com
2026-06-02
Wccftech
wccftech.com
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2026-06-02
www.digitimes.com
2026-06-02
digitimes
Nvidia GTC Taipei opened on June 1 with a packed keynote by CEO Jensen Huang, who kicked off the event by unveiling the widely watched Taiwan supply chain board.
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