Semiconductor News & Analysis Feed

Recent market attention has focused on the collaboration between NVIDIA and TSMC in the area of System-on-Chip (SoIC) packaging. According to TradingView, TSMC is increasing production capacity to meet demand for NVIDIA's Feynman chip packaging, aiming to produce approximately 50,000 SoIC wafers mon

TSMC is launching an unprecedented capacity expansion plan to meet surging demand for AI processors, advanced logic chips, and advanced packaging technologies. Over the past decade, the company has invested nearly $240 billion in capacity expansion, now operating nine sites with dozens of 300mm fabs

The global semiconductor industry stands at a critical inflection point, divided between those who can still shrink transistors and those who cannot. US export controls and the denial of EUV lithography equipment have effectively capped China's front-end chip development. TSMC's SoIC technology deep

TSMC's SoIC technology strengthens its dominance in the AI chip market while deepening lock-in with global AI chip manufacturers. This trend reflects the semiconductor industry's transition from pure process scaling to system-level integration as Moore's Law approaches physical limits. Chinese chip

TSMC announced on May 14, 2026, that it is rapidly expanding its CoWoS (chip-on-wafer-on-substrate) and SoIC (system-on-chip) advanced packaging capacity, driven by surging AI demand. The company is constructing 18 new fabs and advanced packaging facilities worldwide as global AI chip demand continu