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Having a device that works at time zero is no longer a guarantee of reliability over it...

Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf

[News] Intel Foundry Gains Momentum as Google Reportedly Orders 3M TPUs, NVIDIA Evaluates 18A for Multi-Die GPUs 2026-06-09 Semiconductors editor News Please note that this article cites information from The Information, Reuters, The Bull.com, Guru Focus, Wccftech, Futu News, Commercial Times, and Tom’s Hardware. Amid mounting capacity constraints and a widening shift among leading AI pl

Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.

SUNNYVALE, Calif., May 28, 2026 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced at Samsung Advanced Foundry Ecosystem (SAFE) Forum 2026 its latest collaborations with Samsung Foundry on advanced nodes, including an expanded portfolio of production‑ready, AI-powered EDA tools, certified interface IP, and silicon-based test capabilities, enabling customers to bring differentiated AI an

Synopsys has partnered with Samsung Foundry to expand its portfolio of production-ready, AI-powered EDA tools, certified interface IP, and silicon test capabilities. According to the companies, these new offerings will allow customers to bring AI and multi-die designs to market faster and with “measurably improved” quality. – Synopsys The updates were announced during the Samsung Advanced Found

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Home News PR Newswire Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026 Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026 Provided by PR Newswire May 29, 2026, 1:00:00 AM Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest S

Multi-die assemblies give chip architects the option to change some dies while keeping ...

This year’s EE Times Chiplets event will address challenges in the design flow and chiplet technologies to enable straightforward scaling.

Multi-die assemblies are facing full system-level challenges, but engineering teams nee...

Multi-die assemblies greatly increase the number of things that can go wrong, and the d...