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Cadence and Samsung Foundry have expanded their multi-year collaboration to advance semiconductor development for AI infrastructure, high-performance computing (HPC), and physical AI applications. Building on prior work from 2025, the partnership extends memory and interface IP support, including NV

At the Samsung SAFE Forum 2026 held at Samsung Electronics' US office on May 28, SemiFive showcased its advancements in 3D-IC (3D integrated circuit) technology. CEO Brandon Cho presented 'Advanced 3D-IC and Big Die Solutions for AI Innovation,' highlighting how 3D-IC stacks memory directly on compu

At the Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2026 held in San Jose on May 28, 2026, SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced its participation and showcased its latest advancements in 3D-IC and Big Die technologies. CEO and co-founder Bran

The deepened collaboration between Cadence and Samsung Foundry in 2nm process and 3D-IC technology represents a significant advancement in the semiconductor industry's pursuit of higher performance and smaller chip sizes. This partnership exemplifies the industry's shift toward advanced manufacturin