Semiconductor News & Analysis Feed
14 articles
2026-10-19
2026-10-16
2026-09-22
www.chosun.com
2026-09-22
2026-09-22
finance.biggo.com
2026-09-22
Hanmi Semiconductor's delivery of its first FC Bonder 75 to a global customer marks a pivotal strategic inflection point for the South Korean equipment maker. Historically anchored in the HBM TC bonder niche, Hanmi has now crossed into the broader AI back-end packaging equipment space, signaling a d
2026-09-06
2026-09-05
2026-07-23
2026-07-15
news.google.com
2026-07-15
2026-06-30
biz.chosun.com
2026-06-30
Hanmi Semiconductor announced the launch of its new 2.5D TC Bonder 40 equipment on June 30, 2026, aimed at supporting advanced packaging processes for AI system semiconductors. Designed specifically for the CoWoS (Chip on Wafer on Substrate) process, the device can handle dies ranging from 3x3 mm to
2026-06-27
www.digitimes.com
2026-06-27
Hanmi Semiconductor's launch of the FC Bonder 3.5 represents a strategic expansion into advanced packaging, targeting the growing AI chip market. This move demonstrates the company's shift beyond traditional thermal compression bonding equipment toward more sophisticated packaging solutions. The adv
2026-06-27
2026-06-26
biz.chosun.com
2026-06-26
HANMI Semiconductor unveiled its new equipment, the FC Bonder 3.5, designed for artificial intelligence (AI) system semiconductors on June 26, 2026. This device supports 2.5D packaging, enabling the integration of multiple chips such as GPUs, CPUs, and high bandwidth memory (HBM) onto a single subst
2026-06-09
www.techtimes.com
2026-06-09
SK hynix placed a $28.7 million order for Hanmi Semiconductor's TC Bonder 4.5 Griffin, marking the first publicly disclosed contract for this HBM4-generation bonding platform. The order, covering delivery and installation at SK hynix's Cheongju facility by September 2026, confirms Hanmi's capability
2026-05-28
dbr.donga.com
2026-05-28
Hanwha has entered the semiconductor equipment market by launching a hybrid bonding device designed for high-bandwidth memory (HBM) production. This move signifies Hanwha's strategic expansion into advanced packaging and memory manufacturing, key segments in the semiconductor value chain. HBM plays