Hanmi Semiconductor debuts FC Bonder 3.5 to power AI chip packaging expansion - CHOSUNBIZ - Chosunbiz

HANMI Semiconductor unveiled its new equipment, the FC Bonder 3.5, designed for artificial intelligence (AI) system semiconductors on June 26, 2026. This device supports 2.5D packaging, enabling the i... Read original →

Hanmi Semiconductor’s FC Bonder 3.5 signals a strategic pivot from HBM-specific tools to full-stack AI packaging solutions. Technically, its 340mm substrate support and C2W bonding capability accelerate the industry’s shift toward panel-level 2.5D integration, forcing upstream material suppliers to develop high-modulus DAF films and downstream OSATs to recalibrate alignment tolerances. Geopolitically, establishing Hanmi USA isn’t just about proximity to NVIDIA or AMD—it’s a preemptive move against tightening U.S. export controls on advanced packaging gear, reducing compliance overhead through local service hubs. Competitors like ASM Pacific and Besi will likely respond with faster multi-die bonder iterations or defensive IP cross-licensing. Within 18 months, as GPU-HBM stacks exceed 3TB/s per watt, panel-level packaging will transition from niche to norm; if Hanmi secures even one major U.S. IDM partnership, it could capture over 10% of the global AI packaging equipment market by 2027.