Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands

The qualification of Hanmi's 2.5D bonding equipment by a Taiwan-based foundry marks a strategic shift in the packaging supply chain, extending beyond traditional outsourcing into in-house production lines. This development accelerates the adoption of 2.5D/3D integration in AI and 5G applications, as the equipment has now proven its precision, yield, and reliability in mass production. However, geopolitical tensions, particularly amid U.S.-China tech decoupling, pose compliance risks. Stricter export controls in Taiwan could force Hanmi to restructure its supply chain. In market terms, if leading foundries like TSMC and UMC expand internal packaging capabilities, it may squeeze existing packaging vendors. Over the next 12–24 months, the trend toward domestic equipment replacement in advanced packaging will intensify, with Korean vendors like Hanmi poised to gain market share through technological leadership.