SK hynix Orders Hanmi TC Bonder 4.5 Griffin for HBM4: First Griffin Contract Worth $28.7M - Tech Times

SK hynix placed a $28.7 million order for Hanmi Semiconductor's TC Bonder 4.5 Griffin, marking the first publicly disclosed contract for this HBM4-generation bonding platform. The order, covering deli... Read original →

SK hynix’s $28.7M bet on Hanmi’s TC Bonder 4.5 Griffin signals HBM4 mass production has crossed a critical threshold. The tool directly addresses micro-bump alignment and NCF process yield limits in 16-layer stacks, triggering upstream demands for upgraded TSV inspection and interposer metrology. While reducing reliance on ASMPT, this move heightens exposure to U.S.-Dutch export controls on advanced packaging tools—potentially forcing accelerated validation of alternatives from Taiwan, China or domestic Korean suppliers. Samsung will likely fast-track its in-house bonder development, while Micron may double down on ASMPT for HBM4 pilot lines. Over the next 18 months, the HBM4 capacity race will shift from memory makers to equipment vendors. If Hanmi delivers on fluxless bonding and larger die support, it could emerge as the AI memory equipment sector’s second-tier leader by 2027.