Semiconductor News & Analysis Feed

The power semiconductor industry is showing upward momentum today, with ASMPT (00522.HK) leading the gains, rising 11.69% to HK$150.9, and trading HK$525.45 million. HUA HONG GRACE (01347.HK) and SICC (02631.HK) also rose by 5.25% and 9.09%, respectively. This trend reflects growing investor interes

ASMPT Limited (ASMVY) has secured a repeat order from a leading global integrated device manufacturer for eight chip-to-wafer Thermo-Compression Bonding (TCB) tools, reinforcing its growing role in high-bandwidth memory (HBM) and AI packaging. The order, announced on June 8, 2026, follows the custom

ASMPT Limited (ASMVY) has secured a repeat order for eight chip-to-wafer Thermo-Compression Bonding (TCB) tools from a leading global integrated device manufacturer, reinforcing its growing role in high-bandwidth memory (HBM) and AI packaging. The order, which follows the customer's use of ASMPT's F

Citigroup's report highlights that Huawei's 'Tao's Law', unveiled at the IEEE ISCAS conference, marks a paradigm shift in chip design philosophy, moving away from traditional geometric scaling toward time optimization to reduce latency. This approach, exemplified by LogicFolding, uses ultra-fine hyb

Citibank recently released a report highlighting Huawei's introduction of 'Tao's Law' at the IEEE ISCAS conference, signaling a shift in chip design philosophy from traditional geometric scaling toward time efficiency, i.e., reducing latency. This approach emphasizes innovation at the transistor, ci

Applied Materials announced plans to acquire ASMPT's NEXX business unit to enhance its capabilities in advanced packaging. NEXX specializes in large-area advanced packaging deposition equipment for the semiconductor industry, with core expertise in panel-level electrochemical deposition technology.

Applied Materials announced a definitive agreement with ASMPT to acquire the NEXX business unit, aimed at enhancing its capabilities in panel-level chip packaging. NEXX specializes in large-area advanced packaging deposition equipment for the semiconductor industry. This acquisition strengthens Appl