Hanmi targets advanced packaging market with FC Bonder 3.5

Hanmi’s launch of the FC Bonder 3.5 signals a strategic pivot from memory-centric bonding to AI-driven advanced packaging. This move pressures upstream material suppliers to accelerate low-stress, high-thermal-conductivity interface solutions and compels OSATs to overhaul HBM and chiplet integration flows. Amid tightening U.S.-EU export controls on semiconductor tools, any reliance on American components could delay global shipments, inflating customer inventory costs. Competitors like ASM Pacific and Besi may counter by bundling EDA integration or offering full-stack heterogeneous packaging solutions. Within 18 months, the advanced packaging equipment market will stratify: top-tier capacity consolidates among vertically integrated vendors, while mid-to-low tiers face brutal price competition. If Hanmi fails to secure adoption in TSMC’s CoWoS or Samsung’s I-Cube lines by 2027, its growth ceiling will become evident.