Semiconductor News & Analysis Feed

ROHM has introduced the TSC3PAK, a top-side cooling package for SiC MOSFETs designed for high-voltage power conversion in electric vehicles and industrial systems. This surface-mount package (14.00 × 18.58 × 3.50 mm) combines automated mounting with enhanced heat dissipation, approaching the perform

ROHM has introduced the TSC3PAK cooling package for SiC MOSFETs, featuring a top-side heat dissipation design that matches the thermal performance of conventional through-hole packages (TO-247-4L) while enabling automated surface-mount assembly. This advancement is particularly beneficial for power

ROHM has launched a new TSC3PAK package for SiC MOSFETs, featuring a top-side cooling design that enables automated mounting while matching the heat dissipation performance of conventional through-hole packages like TO-247-4L. This innovation is particularly significant for electric vehicle applicat

ROHM's launch of a new top-side cooling package for SiC MOSFETs represents a significant advancement in power semiconductor technology, particularly for high-power applications in electric vehicles, industrial power supplies, and renewable energy systems. SiC MOSFETs are increasingly critical due to