Semiconductor News & Analysis Feed

Omron's launch of new SiC-MOSFET relays represents a significant advancement in power semiconductor technology for high-voltage applications. The adoption of SiC technology delivers superior performance over traditional silicon devices, offering reduced conduction losses, higher operating temperatur

Omron's introduction of SiC-MOSFET relays represents a significant advancement in power semiconductor technology for high-voltage applications. This development highlights the growing importance of wide-bandgap semiconductors in industrial power electronics, where SiC's superior thermal stability, h

Mitsubishi Electric announced that it will begin shipping fifth-generation silicon carbide MOSFET bare die samples in June 2026. While this represents a significant technological advancement in power semiconductor devices, the market reaction was negative, with the company's stock declining by 3%. S

Mitsubishi Electric has announced the sequential shipment of samples for its fifth-generation silicon carbide metal-oxide-semiconductor field-effect transistors (SiC-MOSFETs) in bare die form, set to begin in late June 2026. These new devices feature a proprietary trench structure and deliver indust

Mitsubishi Electric has announced the sampling of fifth-generation silicon carbide metal-oxide-semiconductor field-effect transistors (SiC-MOSFETs) for electric vehicle (xEV) inverter applications, set to ship in late June 2026. These devices offer a 25% reduction in on-resistance compared to their

Mitsubishi Electric has announced that it will begin shipping samples of its fifth-generation silicon carbide metal-oxide-semiconductor field-effect transistors (SiC-MOSFETs) in bare die form in late June 2026. Designed for use in inverters for electric vehicle (EV) drive motors and eAxles, these ne

Mitsubishi Electric announced that it will begin shipping samples of its fifth-generation silicon carbide metal-oxide-semiconductor field-effect transistors (SiC-MOSFETs) in bare die form in late June 2026. These new devices feature a proprietary trench structure and deliver industry-leading low on-