Semiconductor News & Analysis Feed

363 articles
2026-05-30
tomshardware.com 2026-05-30 Kunal Khullar
Intel's next-generation 12V-only PSU standard reportedly adds PMBus support, smaller connectors, and improved power efficiency.
2026-05-29
www.datacenterdynamics.com 2026-05-29 Data Center Dynamics
TSMC customers are more focused on making their hardware energy efficient than any other metric of improvement, Kevin Zhang, deputy co-chief operations officer and SVP at TSMC, said during the company’s Technology Symposium in Amsterdam on May 28. Speaking during a press briefing, Zhang said that across the board – from Edge to mobile, IoT, HPC, or in the data center – customers want “more energy
2026-05-29
sg.finance.yahoo.com 2026-05-29 Yahoo Finance Singapore
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2026-05-29
finance.yahoo.com 2026-05-29 Yahoo Finance
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2026-05-29
digitimes.com 2026-05-29
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed
2026-05-29
digitimes.com 2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
www.marketscreener.com 2026-05-29 marketscreener.com
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2026-05-28
digitimes.com 2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-27
wccftech.com 2026-05-27 Wccftech
FuriosaAI and Broadcom have partnered to build a high-performance AI accelerator chip featuring next-gen HBM4/E memory. FuriosaAI has announced its third-generation AI accelerator, which builds upon its 2nd Generation RNGD platform, which is currently in mass production on TSMC's 5nm process technology. The 2nd Gen RNGD AI platform comes in the form of a 180W PCIe-based design, which aims at LLM
2026-05-27
eetimes.com 2026-05-27
This paper explores how configurable and intelligent I/O technologies are transforming industrial control systems by enabling greater flexibility, improved thermal performance, and higher system uptime. Traditional fixed-function I/O architectures, while effective in stable environments, create inefficiencies through SKU proliferation, underutilized channels, and limited adaptability to late-stage
2026-05-27
letsdatascience.com 2026-05-27 Let's Data Science
INFRASTRUCTURE broadcom furiosaai ai accelerators advanced packaging Broadcom Adds FuriosaAI for Custom AI Accelerators 2 sources | May 27, 2026 6.8 Relevance Score Photo: image.theregister.com · rights & takedowns QUICK SUMMARY Hide Broadcom has added South Korea's FuriosaAI to its roster of partners building AI accelerators on Broadcom's packaging and networking technology, The Register reports
2026-05-27
tomshardware.com 2026-05-27 Luke James
The certifications are valid for three years and were issued jointly by the China Information Technology Security Evaluation Centre and the National Secrecy Science and Technology Evaluation Centre.
2026-05-27
letsdatascience.com 2026-05-27 Let's Data Science
INFRASTRUCTURE texas instruments analog power ai infrastructure semiconductors Texas Instruments Reports AI-Driven Revenue Inflection 1 sources | May 27, 2026 6.8 Relevance Score Photo: static.seekingalpha.com · rights & takedowns QUICK SUMMARY Hide Seeking Alpha reports that Texas Instruments saw a Q1 demand revival driven by AI data-center spending and traditional end markets. According to Seek
2026-05-27
www.newelectronics.co.uk 2026-05-27 New Electronics
分享 LinkedIn Teams WhatsApp Facebook Email X Neil Tyler 27 May 2026 More in Power Industrial Electronics Artificial Intelligence RECOMMENDED STMicroelectronics introduces 700V GaN devices to improve power efficiency Product Launches 2 mins read STMicroelectronics has launched a new range of gallium nitride (GaN)-based power semiconductors aimed at improving energy efficiency and power dens
2026-05-27
letsdatascience.com 2026-05-27 Let's Data Science
FUNDING & BUSINESS micron memory hbm roundhill etf semiconductor etfs Micron Rally Boosts AI Memory ETFs and Funds 4 sources | May 26, 2026 6.9 Relevance Score Photo: cdn.benzinga.com · rights & takedowns QUICK SUMMARY Hide Micron Technology's 2026 surge in AI memory demand is lifting semiconductor ETFs and AI-infrastructure funds, according to coverage from 247wallst and Yahoo Finance. The newly
2026-05-26
newsroom.st.com 2026-05-26 STMicroelectronics
700V PowerGaN devices improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications including home appliances Alexander Jurman Technical Media Relations Tel. +420602748611 alexander.jurman@st.com To receive frequent updates via email, subscribe to our press releases. New gallium nitride (GaN)-based power semicondu
2026-05-26
letsdatascience.com 2026-05-26 Let's Data Science
FUNDING & BUSINESS nvidia michael burry ai demand chip market Michael Burry Warns Nvidia Stock Faces Aggressive Fall 4 sources | May 26, 2026 6.6 Relevance Score Photo: i.insider.com · rights & takedowns QUICK SUMMARY Hide In Substack posts, investor Michael Burry warned that Nvidia stock is vulnerable to an "aggressive fall," saying "The conditions for an aggressive fall are as strong as they ha
2026-05-26
letsdatascience.com 2026-05-26 Let's Data Science
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2026-05-26
digitimes.com 2026-05-26
Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing strong demand for high-efficiency power solutions in AI servers. The company is also beginning to see emerging demand from diversified applications such as AI robotics. As a result, production capacity in 2026 has alread
2026-05-26
digitimes.com 2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo