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FuriosaAI and Broadcom have collaborated to develop a next-generation AI accelerator chip using advanced 2nm process technology and HBM4/E memory, targeting the growing demand for AI inference workloads. The new chip, built upon FuriosaAI's second-generation RNGD platform, emphasizes high bandwidth

Broadcom has expanded its custom ASIC business to include South Korean startup FuriosaAI, aiming to co-develop high-performance AI inference chips using Broadcom's Broadzilla advanced packaging technology. The collaboration leverages Broadcom's Extreme Dimension System in Package (3.5D XDSiP) tech,

Broadcom has expanded its AI hardware ecosystem by partnering with South Korean startup FuriosaAI to develop custom AI accelerators leveraging Broadcom's advanced packaging and networking technologies. According to The Register, FuriosaAI’s third-generation processor will be fabricated on a 2nm node