Semiconductor News & Analysis Feed
11451 articles
2026-06-18
digitimes.com
2026-06-18
A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in the capital market. This has once drawn industry attention to the current business cooperation between WUS and its subsidiary in China, WUS Printed Circuit Kunshan.
2026-06-18
semiengineering.com
2026-06-18
Katherine Derbyshire
Why new designs and process flows could help overcome manufacturing challenges.
2026-06-18
semiengineering.com
2026-06-18
Bryon Moyer
Hybrid bonding permits unprecedented connection density.
2026-06-18
digitimes.com
2026-06-18
Following the announcement in April 2026 that the AI5 chip design had been finalized, Tesla CEO Elon Musk introduced a new benchmark, stating that under yield considerations, the AI6 chip is expected to set a new record for maximum usable computing power per wafer.
2026-06-18
digitimes.com
2026-06-18
Taiwan's electronics industry is stepping up its global ambitions as AI, data center infrastructure, and advanced manufacturing reshape supply chains. Speaking at the Chinese National Association of Industry and Commerce (CNAIC) on June 18, 2026, Foxconn chairman and Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) chairman Young Liu outlined a strategy that combines overseas in
2026-06-18
digitimes.com
2026-06-18
Japanese Prime Minister Sanae Takaichi is scheduled to visit Assam in northeastern India in early July 2026. According to Nikkei, more than 50 Japanese companies and business groups, including Suzuki, Itochu and Toyota Tsusho, are expected to accompany the delegation, with market attention focused on cooperation in semiconductors and infrastructure.
2026-06-18
digitimes.com
2026-06-18
Demand in the passive components market is recovering significantly, lifting operating momentum at Taiwan's two leading suppliers, Yageo and Walsin Technology. Average book-to-bill ratios at both companies have risen above 1.3, placing industry conditions near their highest levels in recent years and reinforcing expectations for sequential growth through 2026.
2026-06-18
digitimes.com
2026-06-18
Backlight module maker Darwin held its shareholders' meeting on June 17, 2026, and said it remains cautiously optimistic about 2026 revenue as its new businesses continue to gain traction. The company cited fresh commercial display orders in the US market and said organ-chip partner Anivance AI is also listed on an "Nvidia backdrop," adding momentum to its medical technology push.
2026-06-18
digitimes.com
2026-06-18
Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.
2026-06-18
digitimes.com
2026-06-18
Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive industrial base and, amid supply chain diversification and geopolitical shifts, has recently attracted record levels of investment.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay for a full wafer run, according to ZDNet Koreaand iNews24.
2026-06-18
eetimes.com
2026-06-18
Pablo Valerio
Experts at RISC-V Summit Europe outlined how open architectures are transforming computing across the space economy.
2026-06-18
digitimes.com
2026-06-18
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on schedule.
2026-06-18
digitimes.com
2026-06-18
Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a step toward moving atomically thin channel materials from laboratory devices closer to semiconductor manufacturing.
2026-06-18
digitimes.com
2026-06-18
Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising artificial intelligence infrastructure spending lifting most of the sector's 27 tracked companies to double-digit year-on-year gains.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin tool installation as early as the second quarter of 2027, with initial volume production expected by the end of that year.
2026-06-18
digitimes.com
2026-06-18
The AI wave is rapidly reshaping the global semiconductor supply chain, and that upheaval is opening a new growth chapter for Taiwan's LED industry. As Taiwan's LED makers move away from the price wars of the consumer market, Nvidia's push to upgrade AI transmission standards to 1.6T, 3.2T, and beyond is exposing the physical limits of copper wiring, making scale-up the first battlefield in the co
2026-06-18
digitimes.com
2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
stocksdownunder.com
2026-06-18
Stocks Down Under
Tape-out clears the path to validation data, with compute-in-memory and TSMC-sourced wafers framing the commercial pitch
dorsaVi (ASX:DVL) has reached the moment its RRAM equity story has been pointing toward for the better part of two years. The company has finalised the full design package for its first integrated RRAM-CMOS validation chip, developed alongside NTU Singapore and ITRI Taiwan, and
2026-06-18
letsdatascience.com
2026-06-18
Let's Data Science
INFRASTRUCTURE
hbm4e
sk hynix
memory
ai infrastructure
SK hynix Ships 12-Layer HBM4E Samples to Customers
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June 17, 2026
7.1
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Photo: manilatimes.net · rights & takedowns
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SK hynix announced it has shipped samples of its 12-layer HBM4E high-bandwidth memory to major customers, according to a PR Newswire release carried by Manila Times, Morningstar and ot