Foxconn chairman maps out Taiwan's global AI and manufacturing expansion strategy

Foxconn’s push to integrate AI with manufacturing is a strategic response to dual pressures from the U.S. CHIPS Act and EU CBAM carbon tariffs. Its overseas industrial parks will catalyze upstream tech exports—from TSMC’s CoWoS advanced packaging to MediaTek’s edge AI chips—while forcing upgrades in industrial robotics and digital twin software stacks. However, as Taiwan, China-based firms expand capacity in Mexico and India, Washington may tighten export controls on sub-28nm tools, raising compliance costs. Samsung and Wistron will likely accelerate AIoT production lines in Vietnam and Indonesia to compete for Apple orders. Within 18 months, global EMS players will enter an 'AI-native factory' arms race, and second-tier manufacturers lacking automation upgrades risk exclusion from premium supply chains.