Semiconductor News & Analysis Feed
19 articles
2026-05-26
www.chosun.com
2026-05-26
조선일보
By Seongmin K
Published 2026.05.27. 00:34
Concept diagram of SK Hynix's iHBM technology. ICE, a thermal control element, serves as a passage for heat dissipation. /SK Hynix
SK Hynix unveiled on the 26th its "iHBM" technology, which significantly reduces heat generation in high-bandwidth memory (HBM) used in AI accelerators.
As demand for AI computations rises, the workload of HBM mounted on AI
2026-05-26
www.tomshardware.com
2026-05-26
Tom's Hardware
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2026-05-26
en.bloomingbit.io
2026-05-26
bloomingbit
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2026-05-26
overclock3d.net
2026-05-26
OC3D
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2026-05-26
cryptobriefing.com
2026-05-26
Crypto Briefing
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2026-05-26
videocardz.com
2026-05-26
VideoCardz.com
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2026-05-26
letsdatascience.com
2026-05-26
Let's Data Science
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2026-05-26
www.koreatimes.co.kr
2026-05-26
The Korea Times
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2026-05-26
www.koreaherald.com
2026-05-26
The Korea Herald
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2026-05-26
www.chosun.com
2026-05-26
조선일보
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2026-05-26
www.trendforce.com
2026-05-26
TrendForce
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2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
technode.global
2026-05-26
TNGlobal
SK hynix unveils ‘iHBM’ thermal solution to boost AI performance
MAY 26, 2026|BY LIUTENG
Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility
SEOUL
2026-05-26
www.techpowerup.com
2026-05-26
TechPowerUp
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2026-05-26
biz.chosun.com
2026-05-26
Chosunbiz
By
Hwang Min-gyu
Published 2026.05.26. 09:13
A concept diagram of iHBM technology released by SK hynix. /Courtesy of SK hynix
SK hynix unveiled next-generation technology that reduces heat by inserting a cooling element inside a high bandwidth memory (HBM) package.
On the 26th, SK hynix said it introduced "iHBM," a technology that embeds an integrated cooling element, ICE, in an HBM package. IC
2026-05-26
www.prnewswire.com
2026-05-26
PR Newswire
SK hynix unveils 'iHBM' thermal solution to boost AI performance
NEWS PROVIDED BY
SK hynix Inc.
May 25, 2026, 19:39 ET
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Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–
2026-05-26
markets.ft.com
2026-05-26
Financial Times
SEOUL, South Korea , May 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-
2026-05-26
sg.finance.yahoo.com
2026-05-26
Yahoo Finance Singapore
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