Semiconductor News & Analysis Feed
27 articles
2026-05-27
www.techtimes.com
2026-05-27
Tech Times
By Allen Lee
Published: May 27 2026, 11:27 AM EDT
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A visitor takes a picture of a model of SK hynix's high-bandwidth memory (HBM) technology during the 2025 World IT Show in Seoul on April 24, 2025. South Korean chip giant SK hynix reported record quarterly profits on April 24, thanks to soaring
2026-05-27
www.techtimes.com
2026-05-27
Tech Times
By Allen Lee
Published: May 27 2026, 11:27 AM EDT
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A visitor takes a picture of a model of SK hynix's high-bandwidth memory (HBM) technology during the 2025 World IT Show in Seoul on April 24, 2025. South Korean chip giant SK hynix reported record quarterly profits on April 24, thanks to soaring
2026-05-27
www.communicationstoday.co.in
2026-05-27
Communications Today
COMPANY NEWS
SK hynix unveils ‘iHBM’ technology to reduce HBM heat
May 27, 2026
SK hynix on May 26 unveiled a new thermal management technology called “iHBM,” designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds.
The key feature of iHBM is an integrated thermal control component called ICE, embedded directly inside the HBM pac
2026-05-27
www.igorslab.de
2026-05-27
igor´sLAB
LATEST NEWS
SK hynix iHBM: Cooling moves directly into the HBM package
27. May 2026 06:00Samir Bashir
📖 Reading time: approx. 4 minutes · 797 words · 5,114 characters
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SK hynix has introduced iHBM, a new thermal solution for future High Bandwidth Memory generations. At first glance, the approach sounds like classic packaging refinement, but it targets a point that is increasingly becoming
2026-05-27
www.igorslab.de
2026-05-27
igor´sLAB
LATEST NEWS
SK hynix iHBM: Cooling moves directly into the HBM package
27. May 2026 06:00Samir Bashir
📖 Reading time: approx. 4 minutes · 797 words · 5,114 characters
🔊
Listen
SK hynix has introduced iHBM, a new thermal solution for future High Bandwidth Memory generations. At first glance, the approach sounds like classic packaging refinement, but it targets a point that is increasingly becoming
2026-05-27
www.thelec.net
2026-05-27
thelec.net
SK hynix unveils its iHBM technology with enhanced thermal dissipation performance on May 26. (Source: SK hynix)
SK hynix on May 26 unveiled a new thermal management technology called "iHBM," designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds.
The key feature of iHBM is an integrated thermal control component called ICE, emb
2026-05-27
www.mk.co.kr
2026-05-27
매일경제
사진 확대
[Photo courtesy of Yonhap News]
SK hynix has unveiled a new iHBM technology that dramatically reduces heat by embedding Integrated Cooling Elements (ICE) in High Bandwidth Memory (HBM) packages.
HBM is a core component of AI semiconductors, but as each new generation stacks more layers and demands for speed continue to rise, heat generation has emerged as the biggest challenge. ICE is a co
2026-05-26
www.chosun.com
2026-05-26
조선일보
By Seongmin K
Published 2026.05.27. 00:34
Concept diagram of SK Hynix's iHBM technology. ICE, a thermal control element, serves as a passage for heat dissipation. /SK Hynix
SK Hynix unveiled on the 26th its "iHBM" technology, which significantly reduces heat generation in high-bandwidth memory (HBM) used in AI accelerators.
As demand for AI computations rises, the workload of HBM mounted on AI
2026-05-26
www.tomshardware.com
2026-05-26
Tom's Hardware
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2026-05-26
en.bloomingbit.io
2026-05-26
bloomingbit
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2026-05-26
overclock3d.net
2026-05-26
OC3D
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2026-05-26
cryptobriefing.com
2026-05-26
Crypto Briefing
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2026-05-26
videocardz.com
2026-05-26
VideoCardz.com
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2026-05-26
letsdatascience.com
2026-05-26
Let's Data Science
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2026-05-26
www.koreatimes.co.kr
2026-05-26
The Korea Times
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2026-05-26
www.koreaherald.com
2026-05-26
The Korea Herald
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2026-05-26
www.chosun.com
2026-05-26
조선일보
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2026-05-26
vir.com.vn
2026-05-26
Vietnam Investment Review - VIR
SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b
2026-05-26
www.trendforce.com
2026-05-26
TrendForce
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2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize