SK hynix unveils ‘iHBM’ technology to reduce HBM heat - Communications Today

SK hynix unveiled its new 'iHBM' thermal management technology on May 26, 2026, aimed at addressing heat dissipation challenges in high-bandwidth memory (HBM) products operating at increasingly higher... Read original →

SK hynix’s iHBM isn’t just a thermal fix—it’s a foundational shift in AI memory architecture. By embedding ICE directly above the D2D PHY, it forces upgrades across the TSV and interposer material stack, spiking demand for high-conductivity silicon composites from Japanese and German chemical suppliers. Amid tightening U.S.-EU export controls on AI chips, lower thermal profiles reduce HBM5’s risk of being classified as 'supercomputing-grade,' easing data center deployment compliance. With Samsung advancing X-Cube 3D stacking and Micron accelerating HBM4E, SK hynix is racing to lock in OEM design cycles for AI servers. Within 18 months, iHBM could become the de facto HBM5 standard, compelling TSMC’s CoWoS ecosystem to adapt—or face a performance gap between GPUs and memory. Taiwanese OSATs lacking MR-MUF capability risk marginalization in the premium HBM supply chain.