SK hynix heads toward the next milestone, unveiling new iHBM technology that sharply reduces heat - 매일경제

SK hynix has unveiled a new iHBM technology designed to significantly reduce heat generation in high bandwidth memory (HBM), a critical component in AI semiconductors. As performance demands increase,... Read original →

By embedding silicon-based Integrated Cooling Elements (ICE) into the D2D interconnect layer of HBM stacks, SK hynix has not only cracked a critical thermal bottleneck in 3D packaging but also redefined the roadmap for advanced memory integration. This forces upstream material suppliers to accelerate development of high-thermal-conductivity, low-k dielectrics, while enabling NVIDIA to sustain higher compute density in its Vera Rubin Ultra GPU. Under intensifying export controls, reliance on validated WLP processes could inflate costs for non-U.S. supply chains. Samsung and Micron will likely counter with hybrid bonding or microfluidic cooling in HBM4E. Within 18 months, HBM5 will become the AI performance inflection point—where thermal management, not bandwidth, dictates customer adoption. The memory race has shifted from speed to coolness.