"Solving HBM Heat Generation"…SK hynix Unveils Memory Solution 'iHBM' - 아시아경제

In the context of the booming artificial intelligence (AI) sector, SK hynix unveiled its next-generation memory technology, 'iHBM,' designed to address the growing challenge of heat generation in high... Read original →

SK hynix’s iHBM shifts thermal management from system-level to package-level, breaking the negative feedback loop between HBM stacking density and power-induced throttling. This forces upstream packaging technologies—TSVs, interposers, and CoWoS—to adapt to embedded cooling architectures and compels GPU designers to revise memory interface thermal budgets. Under the EU Chips Act’s tightening energy-efficiency mandates, iHBM lowers data center PUE, preempting compliance costs. With Micron accelerating HBM4 and Samsung pushing X-Cube, SK hynix leverages its MR-MUF process for rapid scale-up, erecting a time-to-market moat. Over the next 12–24 months, HBM competition will pivot from raw bandwidth to thermal efficiency per watt, making iHBM-like innovations a de facto procurement filter in AI accelerators—and cementing South Korea’s strategic grip on the AI memory value chain.