Semiconductor News & Analysis Feed
20 articles
2026-09-24
chargedevs.com
2026-09-24
2026-09-08
www.rutlandherald.com
2026-09-08
2026-09-08
www.ncnewsonline.com
2026-09-08
Alpha and Omega Semiconductor (AOS) announced the launch of its new αMOS E2™ 600V Super Junction MOSFETs, including AOGT037V60DE2 and AOGT060V60DE2, designed to meet the growing demand for enhanced efficiency and increased power density in high-voltage applications. These devices are tailored for us
2026-09-04
www.electropages.com
2026-09-04
2026-08-27
audioxpress.com
2026-08-27
2026-08-17
chargedevs.com
2026-08-17
2026-08-05
www.aninews.in
2026-08-05
2026-08-05
www.indiagazette.com
2026-08-05
2026-08-05
www.prnewswire.com
2026-08-05
2026-08-05
www.designnews.com
2026-08-05
2026-07-08
www.electronicsweekly.com
2026-07-08
2026-06-22
chargedevs.com
2026-06-22
onsemi's launch of an online tool for pairing SiC MOSFETs with gate drivers represents a significant advancement in electric vehicle charging technology. This innovation addresses the critical need for efficient power management in EV charging systems, where SiC MOSFETs offer superior performance ov
2026-06-17
chargedevs.com
2026-06-17
Wolfspeed's introduction of next-generation Gen 5 SiC MOSFETs represents a significant advancement in electric vehicle power semiconductor technology. These devices specifically target traction inverter applications, addressing critical efficiency and performance requirements for EV propulsion syste
2026-06-13
www.ad-hoc-news.de
2026-06-13
Infineon has launched its new OptiMOS 8 100V MOSFET family, designed to enhance efficiency in motor drives and battery systems. Built on optimized trench MOSFET technology, these devices feature low drain-source on-resistance (RDS(on)), reducing both conduction and switching losses—crucial for high-
2026-06-12
www.bisinfotech.com
2026-06-12
Infineon's launch of the OptiMOS 8 100V Power MOSFET represents a significant advancement in power semiconductor technology. This new product line demonstrates Infineon's continued leadership in developing high-performance power devices that are critical for automotive electronics, industrial applic
2026-06-12
www.eenewseurope.com
2026-06-12
ROHM has introduced the TSC3PAK, a top-side cooling package for SiC MOSFETs designed for high-voltage power conversion in electric vehicles and industrial systems. This surface-mount package (14.00 × 18.58 × 3.50 mm) combines automated mounting with enhanced heat dissipation, approaching the perform
2026-06-11
www.newelectronics.co.uk
2026-06-11
Nexperia's introduction of 1200V SiC MOSFETs in QDPAK packaging represents a significant advancement in power semiconductor technology, specifically addressing critical thermal management challenges in high-power applications. This development targets key sectors including electric vehicles, industr
2026-06-10
www.semiconductor-today.com
2026-06-10
ROHM has launched a new top-side-cooling SiC MOSFET package, the TSC3PAK, designed to enhance power conversion efficiency and reliability in applications such as electric vehicle onboard chargers and compressors. By enabling automated mounting while maintaining heat dissipation performance comparabl
2026-06-10
www.manilatimes.net
2026-06-10
ROHM has launched a new TSC3PAK package for SiC MOSFETs, featuring a top-side cooling design that enables automated mounting while matching the heat dissipation performance of conventional through-hole packages like TO-247-4L. This innovation is particularly significant for electric vehicle applicat
2026-06-10
www.marketscreener.com
2026-06-10
ROHM's launch of a new top-side cooling package for SiC MOSFETs represents a significant advancement in power semiconductor technology, particularly for high-power applications in electric vehicles, industrial power supplies, and renewable energy systems. SiC MOSFETs are increasingly critical due to