Semiconductor News & Analysis Feed
827 articles
2026-05-29
www.devdiscourse.com
2026-05-29
Devdiscourse
Huawei's LogicFolding Revolution: Breaking Through Chip Design Barriers
Huawei's innovative chip design principle, focusing on signal speed rather than shrinking semiconductors, introduces a new path for China amidst U.S. sanctions. Their approach, known as the Tau Scaling Law, seeks to enhance chip efficiency via tightly connected structures, although its true impact remains debated within the in
2026-05-29
telecom.economictimes.indiatimes.com
2026-05-29
ET Telecom
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2026-05-29
www.stocktitan.net
2026-05-29
Stock Titan
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2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-29
digitimes.com
2026-05-29
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads.
2026-05-29
digitimes.com
2026-05-29
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed
2026-05-29
digitimes.com
2026-05-29
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.
2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-29
digitimes.com
2026-05-29
South Korean fabless chip-design company DeepX is using Computex 2026 to broaden partnerships around its neural processing units, or NPUs, as it pushes low-power AI chips for industrial and edge applications.
2026-05-29
neworleanscitybusiness.com
2026-05-29
New Orleans CityBusiness
FILE PHOTO: The logo of Taiwan Semiconductor Manufacturing Company (TSMC) is displayed at TSMC Museum of Innovation in Hsinchu, Taiwan April 9, 2026. REUTERS/Ann Wang/File Photo
A senior TSMC executive said on Thursday that surging electricity demands from AI are making energy efficiency rather than computing power the main constraint shaping future computer chip development.
Kevin Zhang, Senior
2026-05-29
www.gurufocus.com
2026-05-29
GuruFocus
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2026-05-29
www.techedt.com
2026-05-29
Tech Edition
Huawei has unveiled a new chip design strategy to overcome US sanctions and improve processor performance.
Huawei has announced a new chip design strategy that it believes could help the company overcome the impact of long-running US sanctions and develop processors with performance levels comparable to future 1.4nm-class chips.
The Chinese technology company revealed the approach nearly six yea
2026-05-29
kalkinemedia.com
2026-05-29
Kalkine Media
Synopsys Gains Momentum on AI-Driven Chip Design Demand
NASDAQ COMPOSITE
SNPS
4 min read | May 28, 2026 11:43 AM PDT | By Anmol Khazanchi
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2026-05-29
news.synopsys.com
2026-05-29
Synopsys
SUNNYVALE, Calif., May 28, 2026 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced at Samsung Advanced Foundry Ecosystem (SAFE) Forum 2026 its latest collaborations with Samsung Foundry on advanced nodes, including an expanded portfolio of production‑ready, AI-powered EDA tools, certified interface IP, and silicon-based test capabilities, enabling customers to bring differentiated AI an
2026-05-29
www.datacenterdynamics.com
2026-05-29
Data Center Dynamics
Synopsys has partnered with Samsung Foundry to expand its portfolio of production-ready, AI-powered EDA tools, certified interface IP, and silicon test capabilities.
According to the companies, these new offerings will allow customers to bring AI and multi-die designs to market faster and with “measurably improved” quality.
– Synopsys
The updates were announced during the Samsung Advanced Found
2026-05-29
news.google.com
2026-05-29
EDN - Voice of the Engineer
2026-05-29
sg.finance.yahoo.com
2026-05-29
Yahoo Finance Singapore
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2026-05-29
www.morningstar.com
2026-05-29
Morningstar
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Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
Provided by PR Newswire May 29, 2026, 1:00:00 AM
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest S
2026-05-29
www.investing.com
2026-05-29
Investing.com
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