Semiconductor News & Analysis Feed
20 articles
2026-08-20
chargedevs.com
2026-08-20
2026-08-17
chargedevs.com
2026-08-17
2026-08-13
news.google.com
2026-08-13
2026-08-05
www.aninews.in
2026-08-05
2026-08-05
www.indiagazette.com
2026-08-05
2026-08-05
www.engineering.com
2026-08-05
2026-08-05
www.prnewswire.com
2026-08-05
2026-07-08
www.electronicsweekly.com
2026-07-08
2026-06-23
chargedevs.com
2026-06-23
ROHM's introduction of TO-247-class cooling for surface-mount SiC MOSFET packaging represents a significant advancement in power semiconductor technology for electric vehicles. This innovation addresses critical thermal management challenges in high-power applications, enabling more efficient power
2026-06-22
chargedevs.com
2026-06-22
onsemi's launch of an online tool for pairing SiC MOSFETs with gate drivers represents a significant advancement in electric vehicle charging technology. This innovation addresses the critical need for efficient power management in EV charging systems, where SiC MOSFETs offer superior performance ov
2026-06-17
chargedevs.com
2026-06-17
Wolfspeed's introduction of next-generation Gen 5 SiC MOSFETs represents a significant advancement in electric vehicle power semiconductor technology. These devices specifically target traction inverter applications, addressing critical efficiency and performance requirements for EV propulsion syste
2026-06-16
www.ad-hoc-news.de
2026-06-16
Onsemi has introduced its new EliteSiC MOSFET, designed to deliver more efficient and cooler power performance for demanding applications such as electric vehicles, solar inverters, and industrial drives. Built on silicon carbide (SiC) technology, the device features a 1200V rating and a typical on-
2026-06-12
www.ad-hoc-news.de
2026-06-12
Rohm's SCT4013DLL 750V SiC MOSFET is a high-efficiency power device tailored for modern data centers, particularly AI server battery backup units (BBUs) and industrial systems. Built on silicon carbide technology, it offers low conduction losses, high switching frequencies, and compact packaging, ma
2026-06-12
www.eenewseurope.com
2026-06-12
ROHM has introduced the TSC3PAK, a top-side cooling package for SiC MOSFETs designed for high-voltage power conversion in electric vehicles and industrial systems. This surface-mount package (14.00 × 18.58 × 3.50 mm) combines automated mounting with enhanced heat dissipation, approaching the perform
2026-06-11
www.automotivepowertraintechnologyinternational.com
2026-06-11
ROHM has introduced the TSC3PAK cooling package for SiC MOSFETs, featuring a top-side heat dissipation design that matches the thermal performance of conventional through-hole packages (TO-247-4L) while enabling automated surface-mount assembly. This advancement is particularly beneficial for power
2026-06-11
www.newelectronics.co.uk
2026-06-11
Nexperia's introduction of 1200V SiC MOSFETs in QDPAK packaging represents a significant advancement in power semiconductor technology, specifically addressing critical thermal management challenges in high-power applications. This development targets key sectors including electric vehicles, industr
2026-06-10
www.semiconductor-today.com
2026-06-10
ROHM has launched a new top-side-cooling SiC MOSFET package, the TSC3PAK, designed to enhance power conversion efficiency and reliability in applications such as electric vehicle onboard chargers and compressors. By enabling automated mounting while maintaining heat dissipation performance comparabl
2026-06-10
www.manilatimes.net
2026-06-10
ROHM has launched a new TSC3PAK package for SiC MOSFETs, featuring a top-side cooling design that enables automated mounting while matching the heat dissipation performance of conventional through-hole packages like TO-247-4L. This innovation is particularly significant for electric vehicle applicat
2026-06-10
www.marketscreener.com
2026-06-10
ROHM's launch of a new top-side cooling package for SiC MOSFETs represents a significant advancement in power semiconductor technology, particularly for high-power applications in electric vehicles, industrial power supplies, and renewable energy systems. SiC MOSFETs are increasingly critical due to
2026-06-09
www.bisinfotech.com
2026-06-09
ROHM's launch of the TSC3PAK SiC MOSFET package represents a significant advancement in power semiconductor technology, particularly for high-efficiency applications. The top-cooled design addresses critical thermal management challenges in power electronics, enabling better heat dissipation and imp