Semiconductor News & Analysis Feed

176 articles
2026-06-10
www.bisinfotech.com 2026-06-10 Bisinfotech
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2026-06-10
seekingalpha.com 2026-06-10 Seeking Alpha
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2026-06-10
digitimes.com 2026-06-10
Co-Tech said on June 8, 2026, that Nvidia has directly approached it to discuss long-term capacity planning for high-end HVLP4 copper foil, as AI GPU and ASIC demand accelerates and a structural supply bottleneck looms in 2026. Chairman Frank Lee said the market could face a 15–25% supply shortfall in 2026, setting up a two-to-three year upcycle in prices.
2026-06-10
defence-industry.eu 2026-06-10 Defence Industry Europe
Northrop Grumman develops new GaN chip for secure W-band links and next-generation wireless connectivity By Martin Chomsky (Defence Industry Europe) INDUSTRY SPOTLIGHT | June 9, 2026 Photo: Northrop Grumman. Northrop Grumman has developed a new Gallium Nitride chip designed to improve performance for military and commercial radio frequency applications. The company said the chip sets a new sta
2026-06-09
wifinowglobal.com 2026-06-09 Wi-Fi NOW Global
Qualcomm’s new Dragonwing MBM silicon solution combines interactive multimedia with top-tier connectivity & on-device AI June 9, 2026 | INTELLIGENT CONNECTIVITY | by Claus Hetting, Wi-Fi NOW CEO & Chairman By Claus Hetting, WiFi NOW CEO & Chairman It is not often that major chipset vendors introduce an entirely new class of AI-enabled connectivity platforms but Qualcomm did exactly that only tw
2026-06-09
eetimes.com 2026-06-09
Chip technology dives deeper into the Z-axis, pushing metrology to innovate or risk becoming a bottleneck.
2026-06-09
digitimes.com 2026-06-09
As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain bottlenecks, with industry watchers saying the number of components that are currently in a severe shortage now far exceeds those that are not.
2026-06-09
tomshardware.com 2026-06-09 Matt Safford
Levelplay took to Computex with some interesting cooling concepts, like magnetic fans that can be reversed in seconds, and an AIO that puts a big tactile knob for fan control on top of your CPU.
2026-06-09
eetimes.com 2026-06-09
Discover how all-optical neural networks promise ultra-fast, energy-efficient AI—listen now to see if photonics will finally shatter neural bottlenecks.
2026-06-08
www.iotinsider.com 2026-06-08 IOT Insider
SMART WORLD Infineon targets wearable payments market with SECORA Connect X and tokenisation platform NEWS DESK 4 MINUTES AGO 0 Infineon Technologies has launched a new platform designed to bring secure contactless payments to smart wearables, as semiconductor suppliers seek to capitalise on growing demand for connected devices capable of operating independently of smartphones. The German chipm
2026-06-08
eetimes.com 2026-06-08
AI transforms intra-data center networking, accelerating optical innovation while extending decades-long evolution in high-performance connectivity.
2026-06-08
digitimes.com 2026-06-08
US chipmaker Marvell took a more visible stance at Computex 2026, with CEO Matt Murphy delivering a keynote speech and senior executives visiting Taiwan to lay out the company's outlook for AI data center connectivity technology and market opportunities.
2026-06-07
tomshardware.com 2026-06-07 Aaron Klotz
YouTuber challenges himself to alleviate a CPU bottleneck with a Core i7-6700K paired with an RTX 3080 through overclocking.
2026-06-05
news.google.com 2026-06-05 Finimize
2026-06-04
news.google.com 2026-06-04 I-Connect007
2026-06-04
iconnect007.com 2026-06-04 I-Connect007
Global Electronics Association Commends the European Commission for Strengthening Technological Sovereignty by Proposing the Chips Act 2.0 June 4, 2026 | Global Electronics Association Estimated reading time: 2 minutes The Global Electronics Association applauds the European Commission on releasing the Chips Act 2.0 as a critical part of the Technological Sovereignty Package. This proposal marks
2026-06-04
www.newelectronics.co.uk 2026-06-04 New Electronics
分享 LinkedIn Teams WhatsApp Facebook Email X Neil Tyler 04 Jun 2026 More in Internet of Things Artificial Intelligence LMT IoT and Infineon partner to support development of connected edge AI devices News 2 mins read LMT IoT and Infineon Technologies have announced a new partnership aimed at helping startups and product companies accelerate the development and deployment of connected edge arti
2026-06-04
www.theglobeandmail.com 2026-06-04 The Globe and Mail
On May 27, 2026, Texas Instruments’ board appointed long-time executive Julie Knecht as senior vice president and chief financial officer, with the role effective August 1, 2026. She will also continue as chief accounting officer, reflecting the company’s preference for promoting experienced internal talent into top finance leadership roles. Knecht, 54, has been with Texas Instruments for more th
2026-06-04
www.taipeitimes.com 2026-06-04 Taipei Times
Nvidia Corp has begun shipping next-generation co-packaged optics (CPO) switches developed with Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), as the US tech giant seeks to tackle data transmission and power consumption challenges in artificial intelligence (AI) data centers, a Nvidia executive said yesterday. The company has begun shipping its new Spectrum-X CPO switch to select partners, Nv
2026-06-03
finance.yahoo.com 2026-06-03 Yahoo Finance
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