Global Electronics Association Commends the European Commission for Strengthening Technological Sovereignty by Proposing the Chips Act 2.0 - I-Connect007

The Global Electronics Association welcomed the European Commission's introduction of the Chips Act 2.0, recognizing it as a pivotal element of the broader Technological Sovereignty Package. This legi... Read original →

The EU’s Chips Act 2.0 shifts technological sovereignty from silicon-centric to system-level control by explicitly including PCBs and PCBA. This triggers a cascade: upstream materials like high-frequency laminates face new qualification hurdles, while downstream assemblers must adapt to localized standards. Near-term compliance costs will rise 15–20%, yet strategic sectors like defense gain supply chain resilience. The U.S. may counter with expanded DPA Title III subsidies for domestic PCB fabs, while mainland China could accelerate its 'end-product-driven component localization' strategy. Within 18 months, EU PCB capacity utilization may exceed 70%, but advanced HDI and substrate dependencies on Taiwan, China, Japan, and Korea will persist—exposing the structural gap in Europe’s full-stack autonomy ambition.