Semiconductor News & Analysis Feed
120 articles
2026-07-23
digitimes.com
2026-07-23
Lightelligence is positioning optical interconnects, optical switching, and optical computing as the next foundation of AI infrastructure, arguing that the industry's biggest challenge has shifted from faster chips to moving data efficiently across increasingly larger GPU clusters.
2026-07-23
optics.org
2026-07-23
Optics.org
2026-07-21
pressreleasehub.pa.media
2026-07-21
PA Media
2026-07-20
www.datacenterdynamics.com
2026-07-20
Data Center Dynamics
2026-07-20
www.digitimes.com
2026-07-20
digitimes
2026-07-20
digitimes.com
2026-07-20
AI competition is widening from chips to connectivity, memory, talent, patents, and model access, with governments and suppliers tightening control across the stack. Below are the most-read DIGITIMESstories from the week of July 13-19, 2026.
2026-07-16
eetimes.com
2026-07-16
AI data centers are torching copper’s reign as ST pushes 300-mm silicon photonics for faster, denser optical links.
2026-07-16
www.photonics.com
2026-07-16
Photonics Spectra
2026-07-16
digitimes.com
2026-07-16
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon photonics (SiPh) and Co-Packaged Optics (CPO). Benjamin Hein, CEO Electronics and Executive Board member at Merck, said advanced packaging materials are poised to outgrow front-end process materials and the broader mate
2026-07-15
www.photonics.com
2026-07-15
Photonics Spectra
2026-07-14
news.google.com
2026-07-14
Yahoo Finance
2026-07-14
research.arizona.edu
2026-07-14
The University of Arizona
2026-07-14
tomshardware.com
2026-07-14
Etiido Uko
Researchers created a programmable thermal material that steers heat and retains its state without power, a breakthrough that could benefit AI chips, silicon photonics, and infrared devices.
2026-07-14
news.google.com
2026-07-14
Quiver Quantitative
2026-07-14
digitimes.com
2026-07-14
United Microelectronics Corp (UMC) is moving into silicon photonics, positioning itself to address one of the defining bottlenecks in artificial-intelligence data centers: the speed at which chips can talk to one another. In doing so, the mature-node specialist is turning Singapore into a manufacturing base for a technology that uses light rather than electrical signals to move data across AI clus
2026-07-14
digitimes.com
2026-07-14
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.
2026-07-14
eetimes.com
2026-07-14
GlobalFoundries’ Sudipto Bose explains how silicon photonics, GaN and MIPS/ARC fire up physical AI at the edge—watch now.
2026-07-13
eetimes.com
2026-07-13
AI, heterogeneous integration, silicon photonics, chiplets, and quantum computing are converging to define the next generation of complex systems.
2026-07-12
digitimes.com
2026-07-12
Coherent has agreed to prepay AXT US$22.3 million under a three-year agreement for committed 6-inch indium phosphide substrate capacity, showing how buyers are moving to reserve future supply as AI data center investment strains a concentrated photonics materials market.
2026-07-10
finance.yahoo.com
2026-07-10
Yahoo Finance
TSMC’s Photonic Ramp Could Be the Quiet Catalyst in AI Chips
Joey Frenette
July 10, 2026 4 min read
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TSMC shares surged 90% in a year yet still trade at 28x forward earnings, keeping it among the most compelling values in AI chip investing.
TSMC is ramping silicon photonics to mass production, positioni